AT93C46D-PU Atmel, AT93C46D-PU Datasheet - Page 11

• Manufacturer Part Number: AT93C46D-PU
• Description: IC EEPROM 1KBIT 2MHZ 8DIP
• Manufacturer: Atmel

Specifications of AT93C46D-PU

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 1K (128 x 8 or 64 x 16)
• Speed: 250kHz, 1MHz, 2MHz
• Interface: 3-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Organization: 128 K x 8 or 64 K x 16
• Interface Type: 3-Wire
• Maximum Clock Frequency: 2 MHz
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 1.8 V, 5.5 V
• Capacitance, Input: 5 pF
• Capacitance, Output: 5 pF
• Current, Input, Leakage: 0.1 μA
• Current, Operating: 2 mA
• Current, Output, Leakage: 0.1
• Data Retention: 100 yrs.
• Density: 1K
• Package Type: PDIP
• Temperature, Operating: -40 to +85 °C
• Time, Address Setup: 200
• Time, Fall: 1000 ns
• Time, Rise: 1000 ns
• Voltage, Input, High: 2.8 to 6.5 V
• Voltage, Input, Low: 0.54 to 1.65 V
• Voltage, Output, High: 1.6 V
• Voltage, Output, Low: 0.2 V
• Voltage, Supply: 1.8 to 5.5 V
• Memory Configuration: 128 X 8, 64 X 16
• Clock Frequency: 2MHz
• Supply Voltage Range: 1.8V To 5.5V
• Memory Case Style: DIP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4. AT93C46D Ordering Information
Notes:
5193F–SEEPR–1/08
Ordering Code
AT93C46D-PU (Bulk form only)
AT93C46DN-SH-B
AT93C46DN-SH-T
AT93C46D-TH-B
AT93C46D-TH-T
AT93C46DY6-YH-T
AT93C46DU3-UU-T
AT93C46D-W-11
8P3
8S1
8A2
8U3-1
8Y6
−1.8
1. “-B” denotes bulk
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, and dBGA2 = 5K per reel.
3. Available in tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.
Please contact Serial Interface Marketing.
(2)
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8-ball, Die Ball Grid Array Package (dBGA2)
8-lead, 2.00 mm x 3.00 mm Body, 0.50mm Pitch, Ultra-Thin Mini-MAO, Dual No Lead Package. (DFN), (MLP 2x3mm)
Low Voltage (1.8V to 5.5V)
(1)
(3)
(2)
(1)
(NiPdAu Lead finish)
(NiPdAu Lead finish)
(2)
(2)
(NiPdAu Lead finish)
(NiPdAu Lead finish)
(NiPdAu Lead finish)
Package Type
Options
Voltage
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
Package
Die Sale
8U3-1
8P3
8S1
8S1
8A2
8A2
8Y6
Lead-free/Halogen-free/
Industrial Temperature
Operation Range
(−40°C to 85°C)
(−40°C to 85°C)
Industrial
AT93C46D
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