93LC56C-I/P Microchip Technology, 93LC56C-I/P Datasheet - Page 17

• Manufacturer Part Number: 93LC56C-I/P
• Description: IC EEPROM 2KBIT 3MHZ 8DIP
• Manufacturer: Microchip Technology

Specifications of 93LC56C-I/P

• Memory Size: 2K (256 x 8 or 128 x 16)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Operating Temperature: -40°C ~ 85°C
• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Speed: 2MHz, 3MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Organization: 128 K x 16 or 256 x 8
• Interface Type: 2-Wire
• Maximum Clock Frequency: 2 MHz
• Access Time: 6 ms
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 0.5 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V, 5.5 V
• Memory Configuration: 256 X 8, 128 X 16
• Clock Frequency: 3MHz
• Supply Voltage Range: 2.5V To 5.5V
• Memory Case Style: DIP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 93LC56C-I/PR; 93LC56C-I/PR

© 2007 Microchip Technology Inc.
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
N
1
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
eB
E1
b1
N
A
E
D
e
L
c
b
A2
.015
.290
.240
.348
.008
.040
.014
MIN
.115
.115
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
Microchip Technology Drawing C04-018B
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–
DS21794E-page 17