93LC56C-I/P Microchip Technology, 93LC56C-I/P Datasheet - Page 18

• Manufacturer Part Number: 93LC56C-I/P
• Description: IC EEPROM 2KBIT 3MHZ 8DIP
• Manufacturer: Microchip Technology

Specifications of 93LC56C-I/P

• Memory Size: 2K (256 x 8 or 128 x 16)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Operating Temperature: -40°C ~ 85°C
• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Speed: 2MHz, 3MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Organization: 128 K x 16 or 256 x 8
• Interface Type: 2-Wire
• Maximum Clock Frequency: 2 MHz
• Access Time: 6 ms
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 0.5 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V, 5.5 V
• Memory Configuration: 256 X 8, 128 X 16
• Clock Frequency: 3MHz
• Supply Voltage Range: 2.5V To 5.5V
• Memory Case Style: DIP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 93LC56C-I/PR; 93LC56C-I/PR

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
DS21794E-page 18
8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
A1
E1
φ
A2
L1
N
A
E
D
α
e
h
L
φ
c
b
β
1.25
0.10
0.25
0.40
0.17
0.31
MIN
0°
5°
5°
h
L
L1
–
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-057B
α
β
© 2007 Microchip Technology Inc.
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
c