89H32NT24BG2ZCHLGI IDT, 89H32NT24BG2ZCHLGI Datasheet - Page 23
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89H32NT24BG2ZCHLGI
Manufacturer Part Number
89H32NT24BG2ZCHLGI
Description
Peripheral Drivers & Components - PCIs
Manufacturer
IDT
Datasheet
1.89H32NT8AG2ZBHLGI.pdf
(38 pages)
Specifications of 89H32NT24BG2ZCHLGI
Rohs
yes
Part # Aliases
IDT89H32NT24BG2ZCHLGI
IDT 89HPES32NT24AG2 Data Sheet
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
value
J(max)
θ
specified in Table 19. Consequently, the effective junction to ambient thermal resistance (
) for the worst case scenario must be
JA
maintained below the value determined by the formula:
θ
= (T
- T
)/P
JA
J(max)
A(max)
θ
Given that the values of T
, T
, and P are known, the value of desired
becomes a known entity to the system designer. How to
J(max)
A(max)
JA
θ
θ
achieve the desired
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
(value
JA
JC
θ
θ
provided in Table 19), thermal resistance of the chosen adhesive (
), that of the heat sink (
), amount of airflow, and properties of the
CS
SA
circuit board (number of layers and size of the board). It is strongly recommended that users perform their own thermal analysis for their own
board and system design scenarios.
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March 14, 2012