24LC16BH-I/P Microchip Technology, 24LC16BH-I/P Datasheet - Page 14
![IC EEPROM 16KBIT 400KHZ 8DIP](/photos/7/21/72167/24lc16bh-i_p_sml.jpg)
24LC16BH-I/P
Manufacturer Part Number
24LC16BH-I/P
Description
IC EEPROM 16KBIT 400KHZ 8DIP
Manufacturer
Microchip Technology
Datasheets
1.24LC16BT-IST.pdf
(22 pages)
2.24LC16BHT-IOT.pdf
(28 pages)
3.24LC16BH-ESN.pdf
(26 pages)
Specifications of 24LC16BH-I/P
Memory Size
16K (2K x 8)
Package / Case
8-DIP (0.300", 7.62mm)
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Organization
8 Block x 256 x 8
Interface Type
I2C
Maximum Clock Frequency
0.4 MHz
Access Time
900 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.5 V
Maximum Operating Current
3 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
3.3 V, 5 V
Memory Configuration
8 BLK(256 X 8)
Ic Interface Type
I2C
Clock Frequency
400kHz
Supply Voltage Range
2.5V To 5.5V
Memory Case Style
DIP
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
24LC16BH-I/P
Manufacturer:
Microchip Technology
Quantity:
1 980
24AA16/24LC16B
DS21703G-page 14
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
eB
A2
A1
E1
b1
E1
N
A
E
D
e
L
c
b
A2
.115
.015
.290
.240
.348
.115
.008
.040
.014
MIN
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
MAX
.210
.325
.280
.400
.150
.015
.070
.022
.430
.195
c
–