74AUP1G240GM-H NXP Semiconductors, 74AUP1G240GM-H Datasheet - Page 2

• Manufacturer Part Number: 74AUP1G240GM-H
• Description: Buffers & Line Drivers 3V SINGLE BUF/LD INV 3S
• Manufacturer: NXP Semiconductors

Specifications of 74AUP1G240GM-H

• Product Category: Buffers & Line Drivers
• Rohs: yes
• Number Of Input Lines: 1
• Number Of Output Lines: 1
• Polarity: Inverting
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 0.8 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: XSON-6
• High Level Output Current: - 4 mA
• Logic Family: AUP
• Logic Type: CMOS
• Low Level Output Current: 4 mA
• Minimum Operating Temperature: - 40 C
• Number Of Channels Per Chip: 1
• Output Type: 3-State
• Propagation Delay Time: 21.6 ns at 1.1 V to 1.3 V, 12.3 ns at 1.4 V to 1.6 V, 9.5 ns at 1.65 V to 1.95 V, 7.1 ns at 2.3 V to 2.7 V, 6.4 ns at 3 V to 3.6 V
• Factory Pack Quantity: 5000
• Part # Aliases: 74AUP1G240GM,132

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74AUP1G240
Product data sheet
Type number
74AUP1G240GW
74AUP1G240GM
74AUP1G240GF
Type number
74AUP1G240GW
74AUP1G240GM
74AUP1G240GF
74AUP1G240GN
74AUP1G240GS
74AUP1G240GX
74AUP1G240GN
74AUP1G240GS
74AUP1G240GX
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
Logic symbol
2
1
Ordering information
Marking
A
OE
001aac528
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
Y
4
All information provided in this document is subject to legal disclaimers.
Fig 2.
TSSOP5
XSON6
XSON6
XSON6
XSON6
X2SON5
Rev. 4 — 29 June 2012
IEC logic symbol
2
1
OE
Description
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1  1.45  0.5 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1  1  0.5 mm
extremely thin small outline package; no leads;
6 terminals; body 0.9  1.0  0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0  1.0  0.35 mm
X2SON5: plastic thermal enhanced extremely thin
small outline package; no leads; 5 terminals;
body 0.8  0.8  0.35 mm
001aac527
Marking code
p2
p2
p2
p2
p2
p2
Low-power inverting buffer/line driver; 3-state
4
[1]
Fig 3.
OE
A
74AUP1G240
Logic diagram
© NXP B.V. 2012. All rights reserved.
001aac526
Version
SOT353-1
SOT886
SOT891
SOT1115
SOT1202
SOT1226
Y
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