NX3P1107UKZ NXP Semiconductors, NX3P1107UKZ Datasheet - Page 4

• Manufacturer Part Number: NX3P1107UKZ
• Description: Power Switch ICs - Power Distribution Logic controlled hi-side Pwr switch
• Manufacturer: NXP Semiconductors

Specifications of NX3P1107UKZ

• Rohs: yes
• Number Of Outputs: 1
• On Resistance (max): 140 mOhms
• On Time (max): 220 us
• Off Time (max): 118 us
• Operating Supply Voltage: 3.3 V
• Supply Current (max): 1.5 A
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: WLCSP-4
• Maximum Power Dissipation: 300 mW
• Minimum Operating Temperature: - 40 C
• Switch Current (max): 1.5 A

NXP Semiconductors
10. Recommended operating conditions
Table 6.
11. Thermal characteristics
Table 7.
[1]
[2]
12. Static characteristics
Table 8.
V
NX3P1107
Product data sheet
Symbol Parameter
V
T
Symbol
R
Symbol Parameter
V
V
I
I
I
I
GND
S(OFF)
I(VIN)
amb
I
IH
IL
th(j-a)
The overall R
larger Cu layer areas for example, to the power and ground layer. In multi-layer PCB applications, use the second layer to create a large
heat spreader area right below the device. If this layer is either ground or power, connect it with several vias to the top layer connected
to the device ground or supply. Try not to use any solder-stop varnish under the chip.
Rely on the measurement data given for a rough estimation of the R
applications using different layer stacks and layouts
= 0.9 V to 3.6 V, unless otherwise specified; Voltages are referenced to GND (ground = 0 V).
HIGH-level
input voltage
LOW-level
input voltage
input leakage
current
ground current V
OFF-state
leakage
current
input voltage
ambient temperature
Recommended operating conditions
Thermal characteristics
Static characteristics
th(j-a)
Parameter
thermal resistance from junction to ambient
can vary depending on the board layout. To minimize the effective R
Conditions
EN input
EN input
V
see
V
V
and
I(EN)
I(EN)
I(VIN)
I(VOUT)
V
V
V
V
V
V
V
V
I(VIN)
I(VIN)
I(VIN)
I(VIN)
I(VIN)
I(VIN)
I(VIN)
I(VIN)
Figure 5
Figure 11
= 0 V or 3.6 V
= 0 V or 3.6 V; VOUT open;
= 3.6 V; V
= GND or 3.6 V; see
= 0.9 V to 1.1 V
= 1.1 V to 1.3 V
= 1.3 V to 1.8 V
= 1.8 V to 3.6 V
= 0.9 V to 1.1 V
= 1.1 V to 1.3 V
= 1.3 V to 1.8 V
= 1.8 V to 3.6 V
and
All information provided in this document is subject to legal disclaimers.
I(EN)
Figure 6
Conditions
= GND;
Rev. 1 — 9 January 2013
Figure 10
th(j-a)
Conditions
in your application. The actual R
Min
-
-
-
-
-
-
-
-
-
-
-
T
amb
Logic controlled high-side power switch
Typ
0.1
0.1
= 25 C
-
-
-
-
-
-
-
-
-
th(j-a)
, all pins must have a solid connection to
Max
-
-
-
-
-
-
-
-
-
-
-
Min
0.9
40
T
amb
Min
0.8
1.0
1.1
1.1
2
[1][2]
th(j-a)
= 40 C to +85 C Unit
-
-
-
-
-
-
NX3P1107
Max
3.6
+85
value may vary in
Typ
84
© NXP B.V. 2013. All rights reserved.
Max
0.45
0.2
0.3
0.4
2.0
1
-
-
-
-
-
Unit
V
C
Unit
K/W
4 of 16
V
V
V
V
V
V
V
A
A
V
A