MT46H32M16LFBF-6:B TR Micron Technology Inc, MT46H32M16LFBF-6:B TR Datasheet

MT46H32M16LFBF-6:B TR

Manufacturer Part Number

MT46H32M16LFBF-6:B TR

Description

IC DDR SDRAM 512MBIT 60VFBGA

Manufacturer

Micron Technology Inc

Type

DDR SDRAMr

Datasheets

1.MT46H16M32LFCM-6B_TR.pdf (6 pages)

2.MT46H32M16LFBF-6B_TR.pdf (98 pages)

Specifications of MT46H32M16LFBF-6:B TR

Format - Memory

RAM

Memory Type

Mobile DDR SDRAM

Memory Size

512M (32Mx16)

Speed

166MHz

Interface

Parallel

Voltage - Supply

1.7 V ~ 1.95 V

Operating Temperature

0°C ~ 70°C

Package / Case

60-VFBGA

Organization

32Mx16

Density

512Mb

Address Bus

15b

Access Time (max)

6.5/5ns

Maximum Clock Rate

166MHz

Operating Supply Voltage (typ)

1.8V

Package Type

VFBGA

Operating Temp Range

0C to 70C

Operating Supply Voltage (max)

1.95V

Operating Supply Voltage (min)

1.7V

Supply Current

105mA

Pin Count

Mounting

Surface Mount

Operating Temperature Classification

Commercial

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

557-1384-2

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Technical Note

512Mb Mobile DDR: 95nm to 78nm Product Transition Guide

Introduction

Part Number Transition

Table 1:

Status Read Register for 78nm Product

PDF: 09005aef82dfb176 / Source: 09005aef82dfb194

tn4616_512_mddr_95_to_78nm_t37_47m.fm - Rev. B 9/07 EN

Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by

Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications. All

Part Number Replacement Examples

information discussed herein is provided on an “as is” basis, without warranties of any kind.

This document describes critical product differences associated with the 512Mb Mobile

(LP) DDR SDRAM product as it transitions from 95nm process technology to 78nm

process technology. Micron makes every effort to ensure that new replacement products

have full functional compatibility with previous products. This is accomplished through

design, ATE characterization, and target system validation when possible. It is therefore

unlikely that a system that has been designed with a Micron LP DDR SDRAM product

will have any problems with a Micron replacement product. Micron does recommend,

however, that the target system design be fully evaluated with the final version of the

new product prior to conversion.

Examples of replacement part numbers are shown in Table 1. These numbers are

reflected in the data sheet for the replacement product.

The status read register (SRR) has been added to the 78nm product. It is used to read the

manufacturer ID, revision ID, refresh multiplier, width, type, and density of the Mobile

SDRAM, as shown in Figure 1 on page 2. The information made available from this read-

only register can assist the component package manufacturer. It can also be useful for

product operation in the target application. The SRR is read via the LOAD MODE

a full description of the SRR operation.

95nm Part Number

MT46H16M32LFCM-6

MT46H16M32LFCM-6 IT

MT46H16M32LFCM-75

MT46H16M32LFCM-75 IT

MT46H32M16LFCK-6

MT46H32M16LFCK-6 IT

MT46H32M16LFCK-75

MT46H32M16LFCK-75 IT

TN-46-16: 512Mb Mobile DDR: 95nm to 78nm

78nm Part Number

MT46H16M32LFCM-6:B

MT46H16M32LFCM-6 IT:B

MT46H16M32LFCM-6:B

MT46H16M32LFCM-6 IT:B

MT46H32M16LFBF-6:B

MT46H32M16LFBF-6 IT:B

MT46H32M16LFBF-6:B

MT46H32M16LFBF-6 IT:B

Micron Technology, Inc., reserves the right to change products or specifications without notice.

Introduction

Related parts for MT46H32M16LFBF-6:B TR

MT46H32M16LFBF-6:B TR Summary of contents

Page 1

... TN-46-16: 512Mb Mobile DDR: 95nm to 78nm 78nm Part Number MT46H16M32LFCM-6:B MT46H16M32LFCM-6 IT:B MT46H16M32LFCM-6:B MT46H16M32LFCM-6 IT:B MT46H32M16LFBF-6:B MT46H32M16LFBF-6 IT:B MT46H32M16LFBF-6:B MT46H32M16LFBF-6 IT:B Micron Technology, Inc., reserves the right to change products or specifications without notice. 1 ©2007 Micron Technology, Inc. All rights reserved. Introduction ...

Page 2

Figure 1: Status Read Register DQ31...DQ16 DQ15 DQ14 DQ13 31... Reserved Density S15 S14 S13 Density 128Mb 256Mb 512Mb 1,024Mb 0 0 Reserved 1 1 ...

Page 3

Package Differences The 95nm, x16 and x32 products use SAC305 package solder ball composition, as shown in Figure 2. Both the x16 (60-ball) and the x32 (90-ball) packages for the 78nm product use SAC105 solder ball composition. This aligns with ...

Page 4

Figure 3: New 78nm, x16 9mm, 60-ball VFBGA Seating plane A 0.1 A 60x Ø0.45 Dimensions apply to solder balls post-reflow. The pre-reflow balls are Ø0.42 on Ø0.4 SMD ball pads. 3.6 7.2 0.8 TYP ...

Page 5

Table 2: Bond Pad Order Comparison 95nm, Double-Sided x16 BOND_OPT CKE CAS# RAS BA1 BA0 WE# ...

Page 6

Summary Micron periodically offers product performance improvements through process node migration. This is the case with the product transition from 95nm to 78nm. Designers should consult product data sheets for detailed information on product differences before proceeding with product transitions. ...

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