MT46H32M16LFBF-6:B TR Micron Technology Inc, MT46H32M16LFBF-6:B TR Datasheet - Page 3

• Manufacturer Part Number: MT46H32M16LFBF-6:B TR
• Description: IC DDR SDRAM 512MBIT 60VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H32M16LFBF-6:B TR

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 512M (32Mx16)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 60-VFBGA
• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 6.5/5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 105mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1384-2

Package Differences
Figure 2:
PDF: 09005aef82dfb176 / Source: 09005aef82dfb194
tn4616_512_mddr_95_to_78nm_t37_47m.fm - Rev. B 9/07 EN
Seating
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls
are Ø0.42 on Ø0.4
SMD ball pads.
plane
0.1 A
7.2
60X Ø0.45
0.8 TYP
3.6
0.8 TYP
Previous 95nm, x16, 10mm x 11mm, 60-ball VFBGA
A
Notes:
9
The 95nm, x16 and x32 products use SAC305 package solder ball composition, as shown
in Figure 2.
Both the x16 (60-ball) and the x32 (90-ball) packages for the 78nm product use SAC105
solder ball composition. This aligns with the industry trend toward SAC105 composition
for enhanced drop test performance. The surface mount conditions for SAC105 are the
same as for SAC305.
In addition, the 78nm, x16 product offers a smaller, 8mm x 9mm package outline to
conserve application board space, as shown in Figure 3 on page 4. The ball assignments
for both 78nm packages are JEDEC compliant.
1. Dimensions are in millimeters.
8
7
10 ±0.1
6.4
3.2
3
5 ±0.05
2
1
A
B
C
D
G
H
K
TN-46-16: 512Mb Mobile DDR: 95nm to 78nm
E
F
J
3
5.75 ±0.05
Ball A1 ID
0.65 ±0.05
11.5 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
SAC305 (96.5% Sn, 3% Ag, 0.5% Cu)
Substrate material: plastic laminate
Mold compound: epoxy novolac
Package Differences
Ball A1 ID
©2007 Micron Technology, Inc. All rights reserved.