MT46H32M16LFBF-6 IT:B TR Micron Technology Inc, MT46H32M16LFBF-6 IT:B TR Datasheet - Page 4
![IC DDR SDRAM 512MBIT 60VFBGA](/photos/7/23/72331/mt46h32m16lfbf-6_it_b_tr_sml.jpg)
MT46H32M16LFBF-6 IT:B TR
Manufacturer Part Number
MT46H32M16LFBF-6 IT:B TR
Description
IC DDR SDRAM 512MBIT 60VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Specifications of MT46H32M16LFBF-6 IT:B TR
Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
512M (32Mx16)
Speed
166MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
-40°C ~ 85°C
Package / Case
60-VFBGA
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
6.5/5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
105mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1383-2
Figure 3:
Die Bond Pad Order Changes
PDF: 09005aef82dfb176 / Source: 09005aef82dfb194
tn4616_512_mddr_95_to_78nm_t37_47m.fm - Rev. B 9/07 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls are
Ø0.42 on Ø0.4 SMD
ball pads.
Seating
plane
60x Ø0.45
7.2
0.1 A
0.8 TYP
New 78nm, x16, 8 x 9mm, 60-ball VFBGA
0.8 TYP
3.6
Notes:
A
9
1. Dimensions are in millimeters.
The 78nm, JEDEC-standard bond pad order is noticeably different from the 95nm bond
pad order. An example of the differences for the x16 double-sided configuration is
shown in Table 2 on page 5.
The JEDEC pad ordering guidelines do not specify exact placement requirements.
Therefore, they do not guarantee bonding compatibility among vendors. Compatibility
can be verified by direct comparison of die data sheet bond pad information.
8
7
8 ±0.1
6.4
3.2
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
K
4.5 ±0.05
0.65 ±0.05
TN-46-16: 512Mb Mobile DDR: 95nm to 78nm
4
Ball A1 ID
0.3 ±0.025
9 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
Mold compound: epoxy novolac
Solder ball material:
Substrate material: plastic laminate
Die Bond Pad Order Changes
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
©2007 Micron Technology, Inc. All rights reserved.
Micron logo
to be lased
ball A1 ID