HSP061-4M10 STMicroelectronics, HSP061-4M10 Datasheet
HSP061-4M10
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HSP061-4M10 Summary of contents
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... GND 4 I I/O 4 Description The HSP061-4M10 is a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes the device compatible with 3.4 Gbps. The device is packaged in µ ...
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... IPP = 1 A, 8/20 µ MHz I/O OSC MHz I/O OSC -3dB ( 200 ps ( Diff Doc ID 023716 Rev 2 HSP061-4M10 Value Unit -40 to +150 °C -65 to +150 °C 260 °C Min. Typ. Max. Unit ...
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... HSP061-4M10 Figure 2. Leakage current versus junction temperature (typical values) I (nA 0,1 0, Figure 4. Differential impedance (Z 1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 20 V/div ...
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... Ordering information scheme 2 Ordering information scheme Figure 8. Ordering information scheme 4/11 High speed line protection Breakdown voltage Version Number of lines Package µQFN-10L Doc ID 023716 Rev 2 HSP061-4M10 HSP M10 ...
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... HSP061-4M10 3 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. ...
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... Package information Figure 11. µQFN-10L tape and reel specification Dot identifying Pin A1 location 0.30 0.60 All dimensions are typical values in mm 6/11 2.0 4.0 4.0 1.25 User direction of unreeling Doc ID 023716 Rev 2 HSP061-4M10 Ø 1.55 ...
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... HSP061-4M10 4 Recommendation on PCB assembly Figure 12. Recommended stencil window position 10 µm 4.1 Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. ...
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... The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Figure 13. Printed circuit board layout recommendations 500 µm Via to GND 8/ Footprint pad Doc ID 023716 Rev 2 HSP061-4M10 Via to GND PCB tracks ...
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... HSP061-4M10 4.4 Reflow profile Figure 14. ST ECOPACK 250 200 150 100 50 0 Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. ® recommended soldering reflow profile for PCB mounting Temperature (° °C/s 0.9 ° ...
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... Ordering information Table 4. Ordering information Order code HSP061-4M10 6 Revision history Table 5. Document revision history Date 05-Sep-2012 18-Oct-2012 10/11 Marking Package H4M µQFN-10L Revision 1 Initial release. 2 Updated V in Table PP Doc ID 023716 Rev 2 HSP061-4M10 Weight Base qty Delivery mode 3.27 mg 3000 Tape and reel Changes 1. ...
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... HSP061-4M10 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...