HSP061-8M16 STMicroelectronics, HSP061-8M16 Datasheet
HSP061-8M16
Specifications of HSP061-8M16
Available stocks
Related parts for HSP061-8M16
HSP061-8M16 Summary of contents
Page 1
... MIL-STD 883G Method 3015-7 Class 3B: – ■ IEC 61000-4-2 level 4: – (contact discharge) – (air discharge) Applications The HSP061-8M16 is designed to protect against electrostatic discharge on sub micron technology circuits driving: ■ HDMI 1.3 and 1.4 ■ Digital Video Interface ■ Display Port ■ ...
Page 2
... IEC 61000-4- contact ( A), measured 200 to 3000 MHz, I OSC 200 to 3000 MHz, I OSC -3dB ( 200 ps ( 100 Ω Diff Doc ID 18055 Rev 1 HSP061-8M16 Value Unit -40 to +150 °C -65 to +150 °C 260 °C Min. Typ. Max. Unit 6 V 100 0.6 0.8 pF 0.03 ...
Page 3
... HSP061-8M16 Figure 2. Leakage current versus junction temperature (typical values) I (nA) R 1000.0 100.0 10.0 1.0 0 Figure 4. Differential impedance (Z Z 0Diff = 100 Ω HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 3 ...
Page 4
... Ordering information scheme 2 Ordering information scheme Figure 8. Ordering information scheme 4/10 High speed line protection Breakdown Voltage Version Number of lines Package µQFN-16L Doc ID 18055 Rev 1 HSP061-8M16 HSP M16 ...
Page 5
... HSP061-8M16 3 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Table 3. ...
Page 6
... Package information Figure 11. µQFN-16L tape and reel specification Dot identifying Pin A1 location 0.25 0.80 All dimensions are typical values in mm 6/10 2.0 4 4.0 1.80 User direction of unreeling Doc ID 18055 Rev 1 HSP061-8M16 Ø 1. ...
Page 7
... HSP061-8M16 4 Recommendation on PCB assembly Figure 12. Recommended stencil window position 400 µm 400 µm 4.1 Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. ...
Page 8
... GND Footprint pad ® recommended soldering reflow profile for PCB mounting 3°C/s max 3°C/s max 150 sec 90 to 150 sec Doc ID 18055 Rev 1 HSP061-8M16 PCB tracks 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) 10-30 sec 10-30 sec ...
Page 9
... HSP061-8M16 5 Ordering information Table 4. Ordering information Order code HSP061-8M16 6 Revision history Table 5. Document revision history Date 19-Nov-2010 Marking Package HD µQFN-16L Revision 1 Initial release. Doc ID 18055 Rev 1 Ordering information Weight Base qty Delivery mode 12 mg 3000 Tape and reel (7”) Changes 9/10 ...
Page 10
... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 18055 Rev 1 HSP061-8M16 ...