AT24C08B-TH-T Atmel, AT24C08B-TH-T Datasheet - Page 14

• Manufacturer Part Number: AT24C08B-TH-T
• Description: IC EEPROM 8KBIT 1MHZ 8TSSOP
• Manufacturer: Atmel

Specifications of AT24C08B-TH-T

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 8K (1K x 8)
• Speed: 400kHz, 1MHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.
14
Table 6. Ordering Information
AT24C08B Ordering Information
Note:
AT24C04B/08B
AT24C08B-PU
AT24C08BN-SH-B
AT24C08BN-SH-T
AT24C08B-TH-B
AT24C08B-TH-T
AT24C08BY6-YH-T
AT24C08B-TSU-T
AT24C08BU3-UU-T
AT24C08B-W-11
8P3
8S1
8A2
8Y6
5TS1
8U3-1
-1.8
1.
2.
3.
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Array Package (dBGA2)
Low-voltage (1.8V to 5.5V)
“-B” denotes bulk.
“-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K
per reel.
Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Please contact Serial
Interface Marketing.
(2)
(1)
(3)
(2)
(2)
(1)
Ordering Code
(2)
(2)
(Bulk form only)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
Package Type
Voltage
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
Options
Package
Die Sale
8U3-1
5TS1
8P3
8S1
8S1
8A2
8A2
8Y6
Industrial Temperature (-40°C to 85°C)
Lead-free/Halogen-free/
Industrial Temperature
Operational range
(–40°C to 85°C)
5226G–SEEPR–11/09