AT45DB321D-TU Atmel, AT45DB321D-TU Datasheet - Page 2
![IC FLASH 32MBIT 66MHZ 28TSOP](/photos/7/21/72191/313-28-tsop_sml.jpg)
AT45DB321D-TU
Manufacturer Part Number
AT45DB321D-TU
Description
IC FLASH 32MBIT 66MHZ 28TSOP
Manufacturer
Atmel
Specifications of AT45DB321D-TU
Format - Memory
FLASH
Memory Type
DataFLASH
Memory Size
32M (8192 pages x 528 bytes)
Speed
66MHz
Interface
SPI, RapidS
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
28-TSOP
Architecture
Sectored
Interface Type
SPI
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Maximum Operating Current
15 mA
Mounting Style
SMD/SMT
Organization
528 B x 8192
Memory Configuration
8192 Pages X 528 Bytes
Clock Frequency
20MHz
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT45DB321D-TU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
2. Pin Configurations and Pinouts
2
Figure 2-1.
Figure 2-3.
Note:
1. See AT45DCB004D Datasheet.
AT45DB321D [Preliminary]
RESET
SCK
CS
SI
MLF and CASON
Top View through Package
DataFlash Card
Top View through Package
7 6
1
2
3
4
5 4 3 2 1
sequentially access its data. The simple sequential access dramatically reduces active pin
count, facilitates hardware layout, increases system reliability, minimizes switching noise, and
reduces package size. The device is optimized for use in many commercial and industrial appli-
cations where high-density, low-pin count, low-voltage and low-power are essential.
To allow for simple in-system reprogrammability, the AT45DB321D does not require high input
voltages for programming. The device operates from a single power supply, 2.7V to 3.6V, for
both the program and read operations. The AT45DB321D is enabled through the chip select pin
(CS) and accessed via a three-wire interface consisting of the Serial Input (SI), Serial Output
(SO), and the Serial Clock (SCK).
All programming and erase cycles are self-timed.
(1)
8
7
6
5
SO
GND
VCC
WP
Figure 2-2.
Figure 2-4.
Note:
RDY/BUSY
RESET
GND
VCC
SCK
WP
NC
NC
NC
NC
NC
CS
SO
SI
TSOP package is not recommended for new designs. Future die
shrinks will support 8-pin packages only.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SOIC Top View
TSOP Top View: Type 1
RESET
SCK
CS
SI
1
2
3
4
8
7
6
5
SO
GND
VCC
WP
3597H–DFLASH–02/07
28
27
26
25
24
23
22
21
20
19
18
17
16
15
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC