SI7445DP-T1 Vishay/Siliconix, SI7445DP-T1 Datasheet

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SI7445DP-T1

Manufacturer Part Number
SI7445DP-T1
Description
MOSFET 20V 19A 5.4W
Manufacturer
Vishay/Siliconix
Datasheet

Specifications of SI7445DP-T1

Product Category
MOSFET
Transistor Polarity
P-Channel
Drain-source Breakdown Voltage
20 V
Gate-source Breakdown Voltage
+/- 8 V
Continuous Drain Current
12 A
Resistance Drain-source Rds (on)
7.7 mOhms
Configuration
Single
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
PowerPAK SO-8
Fall Time
45 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
1.9 W
Rise Time
45 ns
Factory Pack Quantity
3000
Tradename
TrenchFET
Typical Turn-off Delay Time
400 ns

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SI7445DP-T1-E3
Manufacturer:
VISHAY/威世
Quantity:
20 000
Part Number:
SI7445DP-T1-GE3
Manufacturer:
VISHAY/威世
Quantity:
20 000
Notes
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 71626
S09-0270-Rev. D, 16-Feb-09
Ordering Information: Si7445DP-T1-E3 (Lead (Pb)-free)
PRODUCT SUMMARY
ABSOLUTE MAXIMUM RATINGS T
Parameter
THERMAL RESISTANCE RATINGS
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
Maximum Junction-to-Ambient
Maximum Junction-to-Case (Drain)
V
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
DS
- 20
(V)
8
6.15 mm
D
7
0.0077 at V
0.0094 at V
0.0125 at V
D
6
Si7445DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
D
R
PowerPAK SO-8
Bottom View
DS(on)
5
D
GS
GS
GS
J
a
(Ω)
= 150°C)
= - 4.5 V
= - 2.5 V
= - 1.8 V
a
1
S
2
P-Channel 20-V (D-S) MOSFET
S
a
3
S
5.15 mm
4
G
a
b, c
I
A
D
- 19
- 17
- 15
(A)
= 25 °C, unless otherwise noted
Steady State
Steady State
T
T
T
T
A
A
A
A
t ≤ 10 s
= 25°C
= 70°C
= 25°C
= 70°C
FEATURES
APPLICATIONS
• Halogen-free According to IEC 61249-2-21
• TrenchFET
• New Low Thermal Resistance PowerPAK
• 100 % R
• Load Switch Battery Applications
Symbol
Symbol
T
R
R
J
Available
Package with Low 1.07 mm Profile
V
V
I
P
, T
I
DM
thJA
thJC
I
DS
GS
D
S
D
stg
g
Tested
G
®
P-Channel MOSFET
Power MOSFET
Typical
- 4.3
10 s
- 19
- 15
5.4
3.4
1.0
18
52
S
D
- 55 to 150
- 20
- 50
260
± 8
Steady State
Maximum
- 1.6
- 12
1.9
1.2
1.3
- 9
23
65
Vishay Siliconix
Si7445DP
www.vishay.com
®
°C/W
Unit
Unit
°C
W
V
A
1

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SI7445DP-T1 Summary of contents

Page 1

... Bottom View Ordering Information: Si7445DP-T1-E3 (Lead (Pb)-free) Si7445DP-T1-GE3 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS T Parameter Drain-Source Voltage Gate-Source Voltage a Continuous Drain Current (T = 150°C) J Pulsed Drain Current Continuous Source Current (Diode Conduction) a Maximum Power Dissipation ...

Page 2

... Si7445DP Vishay Siliconix SPECIFICATIONS °C, unless otherwise noted J Parameter Static Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current a On-State Drain Current a Drain-Source On-State Resistance a Forward Transconductance a Diode Forward Voltage b Dynamic Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance ...

Page 3

... Document Number: 71626 S09-0270-Rev. D, 16-Feb-09 15000 12000 100 0.030 0.024 0.018 0.012 °C J 0.006 0.000 0.8 1.0 1.2 Si7445DP Vishay Siliconix C iss 9000 6000 3000 C oss C rss Drain-to-Source Voltage (V) DS Capacitance 1 4 1.4 1 ...

Page 4

... Si7445DP Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 0 250 µA D 0.4 0.2 0.0 - 0 Temperature ( J Threshold Voltage 2 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0. Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0. Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations ...

Page 5

PowerPAK SO-8, (SINGLE/DUAL Notes 1. Inch will govern. 2 Dimensions exclusive of mold gate burrs. 3. Dimensions exclusive of mold flash and cutting burrs. DIM. MIN. A 0.97 A1 0.00 b ...

Page 6

... PowerPAK thermal performance see Application Note 826, Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Sili- conix MOSFETs. Click on the PowerPAK SO-8 single in the index of this document. In this figure, the drain land pattern is given to make full contact to the drain pad on the PowerPAK package. ...

Page 7

... Application Note 826, Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Siliconix MOSFETs. Click on the PowerPAK 1212-8 dual in the index of this doc- ument. The gap between the two drain pads is 24 mils. This matches the spacing of the two drain pads on the Pow- erPAK SO-8 dual package ...

Page 8

THERMAL PERFORMANCE Introduction A basic measure of a device’s thermal performance is the junction-to-case thermal resistance, Rθ junction-to-foot thermal resistance, Rθ is measured for the device mounted to an infinite heat sink and is therefore a characterization of the device ...

Page 9

AN821 Vishay Siliconix SYSTEM AND ELECTRICAL IMPACT OF PowerPAK SO-8 In any design, one must take into account the change in MOSFET r with temperature (Figure 7). DS(on) On-Resistance vs. Junction Temperature 1 1.6 I ...

Page 10

RECOMMENDED MINIMUM PADS FOR PowerPAK 0.024 (0.61) 0.026 (0.66) 0.050 (1.27) Return to Index Return to Index Document Number: 72599 Revision: 21-Jan-08 ® SO-8 Single 0.260 (6.61) 0.150 (3.81) 0.032 (0.82) Recommended Minimum Pads Dimensions in Inches/(mm) Application Note 826 ...

Page 11

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), ...

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