IS61C5128AS-25QLI-TR ISSI, Integrated Silicon Solution Inc, IS61C5128AS-25QLI-TR Datasheet - Page 15

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IS61C5128AS-25QLI-TR

Manufacturer Part Number
IS61C5128AS-25QLI-TR
Description
IC SRAM 4MBIT 25NS 32SOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Datasheet

Specifications of IS61C5128AS-25QLI-TR

Format - Memory
RAM
Memory Type
SRAM - Asynchronous
Memory Size
4M (512K x 8)
Speed
25ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
32-SOP
Density
4Mb
Access Time (max)
25ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
5V
Address Bus
19b
Package Type
SOP
Operating Temp Range
-40C to 85C
Number Of Ports
1
Supply Current
15mA
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
32
Word Size
8b
Number Of Words
512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
PACKAGING INFORMATION
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. C
06/13/03
450-mil Plastic SOP
Package Code: Q (32-pin)
S
No. Leads
Symbol
A1
E1
A
B
C
D
E
S
e
L
α
N
1
e
20.14
13.87
11.18
MILLIMETERS
Min.
0.10
0.36
0.15
0.58
1.27 BSC
20.75
14.38
11.43
Max.
D
3.00
0.51
0.30
0.99
0.86
10°
32
0.004
0.014
0.006
0.793
0.546
0.440
0.023
Min.
B
0.050 BSC
INCHES
E1
A
0.118
0.020
0.012
0.817
0.566
0.450
0.039
0.034
Max.
10°
A1
1-800-379-4774
E
SEATING PLANE
Notes:
1. Controlling dimension: inches, unless
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold
4. Formed leads shall be planar with respect to
L
otherwise specified.
flash protrusions and should be measured
from the bottom of the package.
one another within 0.004 inches at the
seating plane.
α
C

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