ADP5034RE-EVALZ Analog Devices, ADP5034RE-EVALZ Datasheet - Page 27

• Manufacturer Part Number: ADP5034RE-EVALZ
• Description: Power Management IC Development Tools TSSOP ADJ Voltage Apps Board
• Manufacturer: Analog Devices
• Series: ADP5034r

Specifications of ADP5034RE-EVALZ

• Rohs: yes
• Product: Evaluation Boards
• Factory Pack Quantity: 1

Data Sheet
OUTLINE DIMENSIONS
0.15
0.05
COPLANARITY
0.10
1.20 MAX
28
1
SEATING
PLANE
INDICATOR
SEATING
PLANE
0.80
0.75
0.70
PIN 1
Figure 55. 28-Lead Thin Shrink Small Outline with Exposed Pad Package [TSSOP_EP]
TOP VIEW
9.80
9.70
9.60
0.65 BSC
Figure 55. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
TOP VIEW
4.10
4.00 SQ
3.90
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-8.
0.30
0.19
14
15
COMPLIANT TO JEDEC STANDARDS MO-153-AET
4 mm × 4 mm Body, Very Very Thin Quad
Dimensions shown in millimeters
9.7 mm × 6.4 mm Body, (RE-28-1)
Dimensions shown in millimeters
4.50
4.40
4.30
1.05
1.00
0.80
Rev. D | Page 27 of 28
BSC
6.40
0.20 REF
0.50
0.40
0.30
(CP-24-10)
8°
0°
BSC
0.50
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20
0.09
18
13
19
12
0.30
0.25
0.20
BOTTOM VIEW
EXPOSED
PAD
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
EXPOSED
(Pins Up)
3.55
3.50
3.45
PAD
7
0.75
0.60
0.45
24
1
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.25 MIN
2.20
2.10 SQ
2.00
3.05
3.00
2.95
ADP5034