BC846A /T3 NXP Semiconductors, BC846A /T3 Datasheet
BC846A /T3
Specifications of BC846A /T3
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BC846A /T3 Summary of contents
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... BC846 series 65 V, 100 mA NPN general-purpose transistors Rev. 9 — 25 September 2012 1. Product profile 1.1 General description NPN general-purpose transistors in Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BC846 BC846W BC846T [1] Valid for all available selection groups. 1.2 Features and benefits General-purpose transistors ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin SOT23, SOT323, SOT416 Ordering information Table 4. Type number BC846 BC846W BC846T [1] Valid for all available selection groups. 4. Marking Table 5. Type number BC846 BC846A BC846B BC846W BC846AW BC846BW BC846T BC846AT BC846BT [ placeholder for manufacturing site code ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7 ...
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... NXP Semiconductors 7. Characteristics Table amb Symbol I CBO I EBO CEsat V BEsat [1] Pulse test: t [2] V BEsat [ BC846_SER Product data sheet Characteristics C unless otherwise specified. Parameter Conditions collector-base cut-off current 150 C ...
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... NXP Semiconductors 400 h FE (1) 300 (2) 200 (3) 100 0 − 150 C (1) T amb = 25 C (2) T amb = 55 C (3) T amb Fig 1. Selection A: DC current gain as a function of collector current; typical values CEsat (mV (1) (2) (3) 10 − ...
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... NXP Semiconductors 600 h FE (1) 500 400 (2) 300 200 (3) 100 0 − 150 C (1) T amb = 25 C (2) T amb = 55 C (3) T amb Fig 5. Selection B: DC current gain as a function of collector current; typical values CEsat (mV (1) (3) (2) 10 − ...
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... NXP Semiconductors 8. Package outline Fig 9. Fig 10. Package outline SOT323 (SC-70) BC846_SER Product data sheet 3.0 2.8 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Package outline SOT23 (TO-236AB) 2.2 1.8 2.2 1.35 2.0 1.15 1 1.3 Dimensions in mm All information provided in this document is subject to legal disclaimers. Rev. 9 — 25 September 2012 BC846 series 65 V, 100 mA NPN general-purpose transistors 1.1 0.9 3 0.45 0.15 2 0.48 0.15 0.38 0.09 04-11-04 1.1 0.8 0.45 3 ...
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... NXP Semiconductors Fig 11. Package outline SOT416 (SC-75) 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BC846 BC846W BC846T [1] For further information and the availability of packing methods, see [2] Valid for all available selection groups. ...
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... NXP Semiconductors 10. Soldering 3 1.7 Fig 12. Reflow soldering footprint SOT23 (TO-236AB) 4.6 2.6 Fig 13. Wave soldering footprint SOT23 (TO-236AB) BC846_SER Product data sheet 3.3 2.9 1.9 0.7 (3×) 0.5 (3×) 0.6 (3×) 1 2.2 1.2 (2×) 1.4 (2×) 1.4 2.8 4.5 All information provided in this document is subject to legal disclaimers. Rev. 9 — 25 September 2012 BC846 series 65 V, 100 mA NPN general-purpose transistors 2 0 ...
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... NXP Semiconductors Fig 14. Reflow soldering footprint SOT323 (SC-70) 3.65 2.1 Fig 15. Wave soldering footprint SOT323 (SC-70) BC846_SER Product data sheet 2.65 1.85 1.325 2 0.6 3 2.35 (3×) 1 0.55 (3×) 4.6 2.575 1.425 (3×) All information provided in this document is subject to legal disclaimers. Rev. 9 — 25 September 2012 BC846 series 65 V, 100 mA NPN general-purpose transistors 1 ...
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... NXP Semiconductors Fig 16. Reflow soldering footprint SOT416 (SC-75) BC846_SER Product data sheet 65 V, 100 mA NPN general-purpose transistors 2.2 1.7 0.85 0.6 (3×) 1.3 All information provided in this document is subject to legal disclaimers. Rev. 9 — 25 September 2012 BC846 series solder lands solder resist 1 2 solder paste 0.5 (3×) occupied area Dimensions in mm © ...
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... NXP Semiconductors 11. Revision history Table 10. Revision history Document ID Release date BC846_SER v.9 20120925 Modifications: BC846_SER v.8 20120424 BC846_BC546_SER v.7 20091117 BC846_BC546_SER v.6 20060207 BC846_SER Product data sheet Data sheet status Product data sheet • Table 6 “Limiting values”: P values corrected tot Product data sheet Product data sheet Product data sheet All information provided in this document is subject to legal disclaimers ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 Packing information . . . . . . . . . . . . . . . . . . . . . 8 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 12 Legal information ...