BC848B T/R NXP Semiconductors, BC848B T/R Datasheet
BC848B T/R
Specifications of BC848B T/R
Related parts for BC848B T/R
BC848B T/R Summary of contents
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... BC848 series 30 V, 100 mA NPN general-purpose transistors Rev. 07 — 17 November 2009 1. Product profile 1.1 General description NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages. Table 1. Type number BC848B BC848W 1.2 Features General-purpose transistors SMD plastic packages 1.3 Applications General-purpose switching and amplification 1.4 Quick reference data Table 2 ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number BC848B BC848W 4. Marking Table 5. Type number BC848B BC848W [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors Pinning ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7 ...
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... NXP Semiconductors 7. Characteristics Table 8. ° amb Symbol Parameter I collector-base cut-off CBO current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage V base-emitter BEsat saturation voltage V base-emitter voltage transition frequency T C collector capacitance noise figure [1] Pulse test: t ...
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... NXP Semiconductors 600 h FE (1) 500 400 (2) 300 200 (3) 100 0 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 1. BC848B: DC current gain as a function of collector current; typical values CEsat (mV (1) (3) (2) 10 −1 ...
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... NXP Semiconductors 8. Package outline 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 5. Package outline SOT23 (TO-236AB) 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BC848B BC848W [1] For further information and the availability of packing methods, see BC848_SER_7 ...
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... NXP Semiconductors 10. Soldering Dimensions in mm Fig 7. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Dimensions in mm Fig 8. Wave soldering footprint SOT23 (TO-236AB) BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors 2.90 2. 0.85 1.30 3.00 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x 1.20 3 2.80 4.50 Rev. 07 — 17 November 2009 BC848 series solder lands solder resist occupied area 2 ...
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... NXP Semiconductors Fig 9. Reflow soldering footprint SOT323 (SC-70) 3.65 Fig 10. Wave soldering footprint SOT323 (SC-70) BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors 2.65 0.75 1.325 1. 0.60 2.35 0.85 (3×) 1 0.55 (3×) 2.40 4.60 4.00 1. 2.10 1 preferred transport direction during soldering Rev. 07 — 17 November 2009 BC848 series solder lands solder paste 0.50 (3× ...
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... NXP Semiconductors 11. Mounting Dimensions in mm PCB thickness: FR4 PCB = 1.6 mm Fig 11. FR4 PCB, standard footprint SOT23 (TO-236AB) BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors 43.4 0.7 0.6 40 0.6 0.7 0.5 006aaa527 Rev. 07 — 17 November 2009 BC848 series 43.4 0.6 0.55 0.5 Dimensions in mm PCB thickness: FR4 PCB = 1.6 mm Fig 12. FR4 PCB, standard footprint SOT323 (SC-70) © ...
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... Document ID Release date BC848_SER_7 20091117 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 9 “Reflow soldering footprint SOT323 • Figure 10 “Wave soldering footprint SOT323 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information . . . . . . . . . . . . . . . . . . . . . 6 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 Mounting Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 13 Legal information ...