CY7C1371D-100AXC Cypress Semiconductor Corp, CY7C1371D-100AXC Datasheet

IC SRAM 18MBIT 100MHZ 100LQFP

CY7C1371D-100AXC

Manufacturer Part Number
CY7C1371D-100AXC
Description
IC SRAM 18MBIT 100MHZ 100LQFP
Manufacturer
Cypress Semiconductor Corp
Type
Synchronousr
Datasheet

Specifications of CY7C1371D-100AXC

Memory Size
18M (512K x 36)
Package / Case
100-LQFP
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Speed
100MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Access Time
8.5 ns
Maximum Clock Frequency
100 MHz
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3.135 V
Maximum Operating Current
175 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Number Of Ports
4
Operating Supply Voltage
3.3 V
Memory Configuration
1M X 18 / 512K X 36
Clock Frequency
100MHz
Supply Voltage Range
3.135V To 3.6V
Memory Case Style
TQFP
No. Of Pins
100
Rohs Compliant
Yes
Density
18Mb
Access Time (max)
8.5ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
100MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
19b
Package Type
TQFP
Operating Temp Range
0C to 70C
Supply Current
175mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-1631

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1371D-100AXC
Manufacturer:
CYPRESS
Quantity:
465
Part Number:
CY7C1371D-100AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1371D-100AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Cypress Semiconductor Corporation
Document Number: 38-05556 Rev. *I
18-Mbit (512 K × 36/1 M × 18) Flow-through SRAM with NoBL™ Architecture
Features
Note
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
No Bus Latency (NoBL) architecture eliminates dead
cycles between write and read cycles
Supports up to 133-MHz bus operations with zero wait states
Pin-compatible and functionally equivalent to ZBT™ devices
Internally self-timed output buffer control to eliminate the
need to use OE
Registered inputs for flow through operation
Byte write capability
3.3 V/2.5 V IO power supply (V
Fast clock-to-output times
Clock enable (CEN) pin to enable clock and suspend
operation
Synchronous self-timed writes
Asynchronous output enable
Available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free
and non Pb-free 119-ball BGA and 165-ball FBGA package.
Three chip enables for simple depth expansion
Automatic power-down feature available using ZZ mode or
CE deselect
IEEE 1149.1 JTAG-compatible boundary scan
Burst capability — linear or interleaved burst order
Low standby power
Data is transferred on every clock
6.5 ns (for 133-MHz device)
DDQ
Flow-through SRAM with NoBL™ Architecture
)
198 Champion Court
Functional Description
The CY7C1371D/CY7C1373D is a 3.3 V, 512 K × 36/1 M × 18
synchronous flow through burst SRAM designed specifically
to support unlimited true back-to-back read/write operations
with no wait state insertion. The CY7C1371D/CY7C1373D is
equipped with the advanced No Bus Latency (NoBL) logic
required to enable consecutive read/write operations with data
being transferred on every clock cycle. This feature
dramatically improves the throughput of data through the
SRAM, especially in systems that require frequent write-read
transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the clock enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the two or four byte write
select (BW
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous chip enables (CE
asynchronous output enable (OE) provide for easy bank
selection and output tri-state control. To avoid bus contention,
the output drivers are synchronously tri-stated during the data
portion of a write sequence.
18-Mbit (512 K × 36/1 M × 18)
X
San Jose
) and a write enable (WE) input. All writes are
,
CA 95134-1709
[1]
Revised October 21, 2010
1
, CE
CY7C1371D
CY7C1373D
2
, CE
408-943-2600
3
) and an
[+] Feedback

Related parts for CY7C1371D-100AXC

CY7C1371D-100AXC Summary of contents

Page 1

... Cypress Semiconductor Corporation Document Number: 38-05556 Rev. *I 18-Mbit (512 K × 36/1 M × 18) Functional Description The CY7C1371D/CY7C1373D is a 3.3 V, 512 K × 36/1 M × 18 synchronous flow through burst SRAM designed specifically to support unlimited true back-to-back read/write operations with no wait state insertion. The CY7C1371D/CY7C1373D is ...

Page 2

... Logic Block Diagram – CY7C1371D (512 K × 36) ADDRESS A0, A1, A REGISTER MODE CE CLK C CEN WRITE ADDRESS ADV/ READ LOGIC CE1 CE2 CE3 SLEEP ZZ CONTROL Logic Block Diagram – CY7C1373D (1 M × 18) ADDRESS A0, A1, A REGISTER MODE CE CLK C CEN WRITE ADDRESS ADV/ READ LOGIC ...

Page 3

... Read/Write Waveforms ............................................. 24 NOP, STALL AND DESELECT Cycles ..................... 25 ZZ Mode Timing ........................................................ 26 Ordering Information ...................................................... 27 Ordering Code Definitions ......................................... 27 Package Diagrams .......................................................... 28 Acronyms ........................................................................ 31 Document Conventions ................................................. 31 Units of Measure ....................................................... 31 Document History Page ................................................. 32 Sales, Solutions, and Legal Information ...................... 33 Worldwide Sales and Design Support ....................... 33 Products .................................................................... 33 PSoC Solutions ......................................................... 33 CY7C1371D CY7C1373D Page [+] Feedback ...

Page 4

... Selection Guide Maximum access time Maximum operating current Maximum CMOS standby current Document Number: 38-05556 Rev. *I CY7C1371D CY7C1373D 133 MHz 100 MHz Unit 6.5 8.5 ns 210 175 Page [+] Feedback ...

Page 5

... Pin Configurations DQP DDQ BYTE DDQ DDQ BYTE DDQ DQP 30 D Document Number: 38-05556 Rev. *I 100-pin TQFP Pinout CY7C1371D CY7C1371D CY7C1373D 80 DQP DDQ BYTE DDQ DDQ BYTE DDQ DQP A Page [+] Feedback ...

Page 6

... Pin Configurations (continued DDQ DDQ BYTE DDQ DQP DDQ Document Number: 38-05556 Rev. *I 100-pin TQFP Pinout CY7C1373D CY7C1371D CY7C1373D DDQ DQP DDQ BYTE DDQ DDQ Page [+] Feedback ...

Page 7

... Pin Configurations (continued DDQ B NC/576M C NC/ DDQ DDQ DDQ NC/144M DDQ DDQ B NC/576M C NC/ DDQ DDQ DDQ NC/144M T NC/72M U V DDQ Document Number: 38-05556 Rev. *I 119-ball BGA Pinout CY7C1371D (512 K × 36 ADV/ DQP CLK CEN DQP MODE NC/72M TMS TDI TCK TDO CY7C1373D (1 M × ...

Page 8

... DDQ N DQP DDQ P NC/144M NC/72M A R MODE NC/36M NC/576M NC/1G A CE2 DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ DDQ N DQP DDQ P NC/144M NC/72M A R MODE NC/36M A Document Number: 38-05556 Rev. *I 165-ball FBGA Pinout CY7C1371D (512 K × 36 CEN CLK TDI A1 TDO ...

Page 9

... Ground for the device. SS Document Number: 38-05556 Rev. *I Description are fed to the two-bit burst counter. to select/deselect the device select/deselect the device select/deselect the device. 2 are placed in a tri-state condition.The outputs are automatically tri-stated during [A:D] CY7C1371D CY7C1373D . s or left floating selects interleaved DD Page [+] Feedback ...

Page 10

... SRAM is deselected at clock rise by one of the chip enable signals, its output is tri-stated immediately. Burst Read Accesses ) is The CY7C1371D/CY7C1373D has an on-chip burst counter that CDV allows the user the ability to supply a single address and conduct up to four reads without reasserting the address inputs. ADV/LD ...

Page 11

... Byte write capability has been included to greatly simplify read/modify/write sequences, which can be reduced to simple byte write operations. Because the CY7C1371D/CY7C1373D is a common IO device, data must not be driven into the device while the outputs are active. The output enable (OE) can be deasserted HIGH before presenting data to the DQs and DQP inputs ...

Page 12

... Next NOP/write abort (begin burst) None Write abort (continue burst) Next Ignore clock edge (stall) Current Sleep mode None Partial Truth Table for Read/Write Function (CY7C1371D) Read Write no bytes written Write byte A – (DQ and DQP ) A A Write byte B – (DQ and DQP ...

Page 13

... IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1371D/CY7C1373D incorporates a serial boundary scan test access port (TAP).This part is fully compliant with 1149.1. The TAP operates using JEDEC-standard 3 2 logic levels. The CY7C1371D/CY7C1373D contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register ...

Page 14

... When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO balls. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. CY7C1371D CY7C1373D Page [+] Feedback ...

Page 15

... TAP controller is in the “Test-Logic-Reset” state. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions CYC TL t TMSS t TMSH t TDIS t TDIH t TDOX DON’T CARE UNDEFINED CY7C1371D CY7C1373D TDOV Page [+] Feedback ...

Page 16

... Notes 10. t and t refer to the setup and hold time requirements of latching data from the boundary scan register 11. Test conditions are specified using the load in TAP AC test Conditions. t Document Number: 38-05556 Rev. *I Description / ns CY7C1371D CY7C1373D Min Max Unit 50 – ns – 20 MHz 20 – ...

Page 17

... DDQ DDQ DDQ I = 100 µ DDQ V DDQ V DDQ V DDQ V DDQ V DDQ GND < V < DDQ CY7C1371D CY7C1373D to 2 1.25V 50Ω 50Ω 20pF O Min Max Unit = 3.3 V 2.4 – 2.5 V 2.0 – 3.3 V 2.9 – 2.5 V 2.1 – 3.3 V – 0 ...

Page 18

... Reserved for internal use 001001 001001 Defines memory type and architecture 100101 010101 Defines width and density 00000110100 00000110100 Allows unique identification of SRAM vendor 1 1 Indicates the presence register Bit Size (× 36 Description CY7C1371D CY7C1373D Description Bit Size (× 18 Page [+] Feedback ...

Page 19

... BGA Boundary Scan Order Bit # Ball ID Bit # Notes 13. Balls which are NC (No Connect) are pre-set LOW. 14. Bit pre-set HIGH. Document Number: 38-05556 Rev. *I [13, 14] Ball ID Bit # Ball CY7C1371D CY7C1373D Bit # Ball Internal Page [+] Feedback ...

Page 20

... G11 25 F11 26 E11 27 D11 28 G10 29 F10 30 E10 Note 15. Balls which are NC (No Connect) are pre-set LOW. 16. Bit pre-set HIGH. Document Number: 38-05556 Rev. *I [15, 16] Bit # Ball ID 31 D10 32 C11 33 A11 34 B11 35 A10 36 B10 C10 CY7C1371D CY7C1373D Bit # Ball Internal Page [+] Feedback ...

Page 21

... Max, device deselected, All Speeds  V  0.3 V, – 0 /2), undershoot: V (AC) > –2 V (Pulse width less than t CYC IL (min) within 200 ms. During this time V < V and CY7C1371D CY7C1373D + 0 Ambient DDQ Temperature 0 °C to +70 °C 3.3 V– 2.5 V – 10 Min Max Unit 3 ...

Page 22

... EIA/JESD51 317  3 DDQ GND 351  INCLUDING JIG AND (b) SCOPE R = 1667  2 DDQ GND 1538  INCLUDING JIG AND (b) SCOPE CY7C1371D CY7C1373D 119 BGA 165 FBGA Unit Package Package 119 BGA 165 FBGA Unit Package Package C/W 23.8 20.7  ...

Page 23

... V. DDQ is the time that the power needs to be supplied above V and t is less than t to eliminate bus contention between SRAMs when sharing the same data OELZ CHZ CLZ CY7C1371D CY7C1373D 100 MHz Unit Max Min Max – 1 – ms – ...

Page 24

... DOH t OEV t CLZ D(A2+1) Q(A3) Q(A4) t OEHZ t OELZ READ READ BURST Q(A3) Q(A4) READ Q(A4+1) DON’T CARE UNDEFINED is LOW. When CE is HIGH HIGH CY7C1371D CY7C1373D CHZ Q(A4+1) D(A5) Q(A6) D(A7) t DOH W RITE READ W RITE DESELECT D(A5) Q(A6) D(A7) is LOW HIGH ...

Page 25

... The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrates CEN being used to create a pause. A write is not performed during this cycle. Document Number: 38-05556 Rev. *I [29, 30, 31 Q(A2) Q(A3) STALL READ WRITE STALL Q(A3) D(A4) DON’T CARE UNDEFINED is LOW. When CE is HIGH HIGH CY7C1371D CY7C1373D CHZ D(A4) Q(A5) t DOH NOP READ DESELECT CONTINUE Q(A5) DESELECT is LOW HIGH Page [+] Feedback ...

Page 26

... Device must be deselected when entering ZZ mode. See truth table for all possible signal conditions to deselect the device. 33. DQs are in high Z when exiting ZZ sleep mode. Document Number: 38-05556 Rev ZZREC t RZZI DESELECT or READ Only High-Z DON’T CARE CY7C1371D CY7C1373D Page [+] Feedback ...

Page 27

... Fine-Pitch Ball Grid Array (13 × 15 × 1.4 mm) CY7C1371D-133AXC 51-85050 100-pin Thin Quad Flat Pack (14 × 20 × 1.4 mm) Pb-free CY7C1373D-133AXI 100 CY7C1371D-100AXC 51-85050 100-pin Thin Quad Flat Pack (14 × 20 × 1.4 mm) Pb-free CY7C1373D-100AXC CY7C1371D-100AXI 51-85050 100-pin Thin Quad Flat Pack (14 × 20 × 1.4 mm) Pb-free ...

Page 28

... Package Diagrams Figure 1. 100-pin Thin Plastic Quad Flatpack (14 × 20 × 1.4 mm), 51-85050 Document Number: 38-05556 Rev. *I CY7C1371D CY7C1373D 51-85050 *C Page [+] Feedback ...

Page 29

... Package Diagrams (continued) Figure 2. 119-ball BGA (14 × 22 × 2.4 mm), 51-85115 Document Number: 38-05556 Rev. *I CY7C1371D CY7C1373D 51-85115 *C Page [+] Feedback ...

Page 30

... Package Diagrams (continued) Figure 3. 165-ball FPBGA (13 × 15 × 1.4 mm), 51-85180 Document Number: 38-05556 Rev. *I CY7C1371D CY7C1373D 51-85180 *C Page [+] Feedback ...

Page 31

... WE write enable Document Number: 38-05556 Rev. *I Document Conventions Units of Measure Symbol Unit of Measure ns nano seconds V Volts µA micro Amperes mA milli Amperes mm milli meter ms milli seconds MHz Mega Hertz pF pico Farad W Watts °C degree Celcius CY7C1371D CY7C1373D Page [+] Feedback ...

Page 32

... Document History Page Document Title: CY7C1371D/CY7C1373D 18-Mbit (512 K × 36/1 M × 18) Flow-through SRAM with NoBL™ Architecture Document Number: 38-05556 Submission Orig. of REV. ECN NO. Date Change ** 254513 See ECN *A 288531 See ECN *B 326078 See ECN *C 345117 See ECN *D 416321 See ECN ...

Page 33

... Document Number: 38-05556 Rev. *I NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc. All products and company names mentioned in this document may be the trademarks of their respective holders. cypress.com/go/plc Revised October 21, 2010 CY7C1371D CY7C1373D PSoC Solutions psoc.cypress.com/solutions PSoC 1 ...

Related keywords