AT27C020-70JC Atmel, AT27C020-70JC Datasheet - Page 2

IC OTP 2MBIT 70NS 32PLCC

AT27C020-70JC

Manufacturer Part Number
AT27C020-70JC
Description
IC OTP 2MBIT 70NS 32PLCC
Manufacturer
Atmel
Datasheets

Specifications of AT27C020-70JC

Format - Memory
EPROMs
Memory Type
OTP EPROM
Memory Size
2M (256K x 8)
Speed
70ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Package / Case
32-PLCC
Density
2Mb
Organization
256Kx8
Interface Type
Parallel
Bus Type
Parallel
In System Programmable
External
Access Time (max)
70ns
Package Type
PLCC
Reprogramming Technique
OTP
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Supply Current
25mA
Pin Count
32
Mounting
Surface Mount
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT27C020-70JC
Quantity:
40
Part Number:
AT27C020-70JC
Manufacturer:
Atmel
Quantity:
10 000
The AT27C020 is available in a choice of industry standard
JEDEC-approved one-time programmable (OTP) plastic
PDIP, PLCC, and TSOP packages. All devices feature two-
line control (CE, OE) to give designers the flexibility to pre-
vent bus contention.
With 256K byte storage capability, the AT27C020 allows
firmware to be stored reliably and to be accessed by the
system without the delays of mass storage media.
Atmel’s 27C020 have additional features to ensure high
quality and efficient production use. The Rapid
ming Algorithm reduces the time required to program the
part and guarantees reliable programming. Programming
time is typically only 100 s/byte. The Integrated Product
Identification Code electronically identifies the device and
manufacturer. This feature is used by industry standard
programming equipment to select the proper programming
algorithms and voltages.
Block Diagram
2
AT27C020
Program-
System Considerations
Switching between active and standby conditions via the
Chip Enable pin may produce transient voltage excursions.
Unless accommodated by the system design, these tran-
sients may exceed data sheet limits, resulting in device
non-conformance. At a minimum, a 0.1 F high frequency,
low inherent inductance, ceramic capacitor should be uti-
lized for each device. This capacitor should be connected
between the V
close to the device as possible. Additionally, to stabilize the
supply voltage level on printed circuit boards with large
EPROM arrays, a 4.7 F bulk electrolytic capacitor should
be utilized, again connected between the V
terminals. This capacitor should be positioned as close as
possible to the point where the power supply is connected
to the array.
CC
and Ground terminals of the device, as
CC
and Ground

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