AT45DB081B-TC-2.5 Atmel, AT45DB081B-TC-2.5 Datasheet - Page 8

• Manufacturer Part Number: AT45DB081B-TC-2.5
• Description: IC FLASH 8MBIT 20MHZ 28TSOP
• Manufacturer: Atmel

Specifications of AT45DB081B-TC-2.5

• Format - Memory: FLASH
• Memory Type: DataFLASH
• Memory Size: 8M (4096 pages x 264 bytes)
• Speed: 20MHz
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-TSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Operation Mode
Summary
Pin Descriptions
8
AT45DB081B
If a sector is programmed or reprogrammed sequentially page-by-page, then the programming
algorithm shown in <blue>Figure 1 on <blue>page 26 is recommended. Otherwise, if multiple
bytes in a page or several pages are programmed randomly in a sector, then the programming
algorithm shown in <blue>Figure 2 on <blue>page 27 is recommended. Each page within a sec-
tor must be updated/rewritten at least once within every 10,000 cumulative page erase/program
operations in that sector.
The modes described can be separated into two groups – modes which make use of the Flash
memory array (Group A) and modes which do not make use of the Flash memory array (Group
B).
Group A modes consist of:
1. Main Memory Page Read
2. Main Memory Page to Buffer 1 (or 2) Transfer
3. Main Memory Page to Buffer 1 (or 2) Compare
4. Buffer 1 (or 2) to Main Memory Page Program with Built-in Erase
5. Buffer 1 (or 2) to Main Memory Page Program without Built-in Erase
6. Page Erase
7. Block Erase
8. Main Memory Page Program through Buffer
9. Auto Page Rewrite
Group B modes consist of:
1. Buffer 1 (or 2) Read
2. Buffer 1 (or 2) Write
3. Status Register Read
If a Group A mode is in progress (not fully completed) then another mode in Group A should not
be started. However, during this time in which a Group A mode is in progress, modes in Group B
can be started.
This gives the Serial DataFlash the ability to virtually accommodate a continuous data stream.
While data is being programmed into main memory from buffer 1, data can be loaded into buffer
2 (or vice versa). See application note AN-4 (“Using Atmel’s Serial DataFlash”) for more details.
SERIAL INPUT (SI): The SI pin is an input-only pin and is used to shift data into the device. The
SI pin is used for all data input including opcodes and address sequences.
SERIAL OUTPUT (SO): The SO pin is an output-only pin and is used to shift data out from the
device.
SERIAL CLOCK (SCK): The SCK pin is an input-only pin and is used to control the flow of data
to and from the DataFlash. Data is always clocked into the device on the rising edge of SCK and
clocked out of the device on the falling edge of SCK.
CHIP SELECT (CS): The DataFlash is selected when the CS pin is low. When the device is not
selected, data will not be accepted on the SI pin, and the SO pin will remain in a high-impedance
state. A high-to-low transition on the CS pin is required to start an operation, and a low-to-high
transition on the CS pin is required to end an operation.
2225J–DFLSH–2/08