MT47H32M16BN-25E IT:D TR Micron Technology Inc, MT47H32M16BN-25E IT:D TR Datasheet - Page 18

• Manufacturer Part Number: MT47H32M16BN-25E IT:D TR
• Description: IC DDR2 SDRAM 512MBIT 84FBGA
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16BN-25E IT:D TR

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 512M (32Mx16)
• Speed: 2.5ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 84-FBGA
• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 400ps
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 295mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 9: 60-Ball FBGA (8mm x 10mm) – x4, x8
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. O 7/09 EN
Solder ball material:
Pb-free – (SAC305) SnAgCu
Pb – (Eutectic) SnPbAg
Dimensions apply to solder
balls post-reflow on Ø0.33
NSMD ball pads.
60X Ø0.45
Seating
Note:
0.12 A
Plane
8 CTR
0.8 TYP
1. All dimensions are in millimeters.
A
9 8 7
6.4 CTR
8 ±0.15
0.8 TYP
3 2 1
A
B
C
D
E
F
G
H
J
K
L
0.8 ±0.1
18
Exposed
gold-plated pad
1.0mm (MAX) X
0.7mm (NOM)
nonconductive floating pad
10 ±0.15
Ball A1 ID
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
©2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging