MT47H32M16BN-25E IT:D TR Micron Technology Inc, MT47H32M16BN-25E IT:D TR Datasheet - Page 3

• Manufacturer Part Number: MT47H32M16BN-25E IT:D TR
• Description: IC DDR2 SDRAM 512MBIT 84FBGA
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16BN-25E IT:D TR

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 512M (32Mx16)
• Speed: 2.5ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 84-FBGA
• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 400ps
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 295mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Contents
State Diagram .................................................................................................................................................. 8
Functional Description ..................................................................................................................................... 9
Functional Block Diagrams ............................................................................................................................. 11
Ball Assignments and Descriptions ................................................................................................................. 13
Packaging ...................................................................................................................................................... 17
Electrical Specifications – Absolute Ratings ..................................................................................................... 20
Electrical Specifications – I
AC Timing Operating Specifications ................................................................................................................ 27
AC and DC Operating Conditions .................................................................................................................... 38
ODT DC Electrical Characteristics ................................................................................................................... 39
Input Electrical Characteristics and Operating Conditions ............................................................................... 40
Output Electrical Characteristics and Operating Conditions ............................................................................. 43
Output Driver Characteristics ......................................................................................................................... 45
Power and Ground Clamp Characteristics ....................................................................................................... 49
AC Overshoot/Undershoot Specification ......................................................................................................... 50
Input Slew Rate Derating ................................................................................................................................ 52
Commands .................................................................................................................................................... 65
Mode Register (MR) ........................................................................................................................................ 71
Extended Mode Register (EMR) ....................................................................................................................... 76
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. O 7/09 EN
Industrial Temperature ................................................................................................................................ 9
Automotive Temperature ........................................................................................................................... 10
General Notes ............................................................................................................................................ 10
Package Dimensions .................................................................................................................................. 17
FBGA Package Capacitance ......................................................................................................................... 19
Temperature and Thermal Impedance ........................................................................................................ 20
I
I
Truth Tables ............................................................................................................................................... 65
DESELECT ................................................................................................................................................. 69
NO OPERATION (NOP) .............................................................................................................................. 70
LOAD MODE (LM) ..................................................................................................................................... 70
ACTIVATE .................................................................................................................................................. 70
READ ......................................................................................................................................................... 70
WRITE ....................................................................................................................................................... 70
PRECHARGE .............................................................................................................................................. 71
REFRESH ................................................................................................................................................... 71
SELF REFRESH ........................................................................................................................................... 71
Burst Length .............................................................................................................................................. 72
Burst Type ................................................................................................................................................. 73
Operating Mode ......................................................................................................................................... 73
DLL RESET ................................................................................................................................................. 73
Write Recovery ........................................................................................................................................... 74
Power-Down Mode .................................................................................................................................... 74
CAS Latency (CL) ........................................................................................................................................ 75
DLL Enable/Disable ................................................................................................................................... 77
Output Drive Strength ................................................................................................................................ 77
DQS# Enable/Disable ................................................................................................................................. 77
RDQS Enable/Disable ................................................................................................................................. 77
Output Enable/Disable ............................................................................................................................... 77
On-Die Termination (ODT) ........................................................................................................................ 78
DD
DD7
Specifications and Conditions ............................................................................................................... 23
Conditions .......................................................................................................................................... 23
DD
Parameters ........................................................................................................ 23
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
©2004 Micron Technology, Inc. All rights reserved.