CY7C1361A-100AC Cypress Semiconductor Corp, CY7C1361A-100AC Datasheet

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CY7C1361A-100AC

Manufacturer Part Number
CY7C1361A-100AC
Description
IC SRAM 9MBIT 100MHZ 100LQFP
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1361A-100AC

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
9M (256K x 36)
Speed
100MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
428-1117
Cypress Semiconductor Corporation
Document #: 38-05259 Rev. *C
Features
Functional Description
The Cypress Synchronous Burst SRAM family employs
high-speed, low-power CMOS designs using advanced
triple-layer polysilicon, double-layer metal technology. Each
memory cell consists of four transistors and two high-valued
resistors.
The CY7C1361A and CY7C1363A SRAMs integrate 262,144
× 36 and 524,288 × 18 SRAM cells with advanced
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
• Fast access times: 6.0, 6.5, 7.0, and 8.0 ns
• Fast clock speed: 150, 133, 117, and 100 MHz
• Fast OE access times: 3.5 ns and 4.0 ns
• Optimal for depth expansion (one cycle chip deselect
• 3.3V –5% and +10% power supply
• 3.3V or 2.5V I/O supply
• 5V tolerant inputs except I/Os
• Clamp diodes to V
• Common data inputs and data outputs
• Byte Write Enable and Global Write control
• Multiple chip enables for depth expansion: A package
• Address pipeline capability
• Address, data, and control registers
• Internally self-timed Write cycle
• Burst control pins (interleaved or linear burst
• Automatic power-down feature available using ZZ
• JTAG boundary scan for BG and AJ package version
• Low-profile 119-bump 14-mm × 22-mm PBGA (Ball Grid
to eliminate bus contention)
version and two chip enables for BGA and AJ package
versions
sequence)
mode or CE deselect.
Array) and 100-pin TQFP packages
SS
at all inputs and outputs
7C1361A-150
7C1363A-150
3901 North First Street
480
6.0
10
256K x 36/512K x 18 Synchronous
7C1361A-133
7C1363A-133
synchronous peripheral circuitry and a two-bit counter for
internal burst operation. All synchronous inputs are gated by
registers controlled by a positive-edge-triggered Clock Input
(CLK). The synchronous inputs include all addresses, all data
inputs, address-pipelining Chip Enable (CE), depth-expansion
Chip Enables (CE
ADSP, and ADV), Write Enables (BWa, BWb, BWc, BWd, and
BWE), and global Write (GW). However, the CE
input is only available for the TA package version.
Asynchronous inputs include the Output Enable (OE) and
burst mode control (MODE). The data outputs (Q), enabled by
OE, are also asynchronous.
Addresses and chip enables are registered with either
Address Status Processor (ADSP) or Address Status
Controller (ADSC) input pins. Subsequent burst addresses
can be internally generated as controlled by the Burst Advance
Pin (ADV).
Address, data inputs, and Write controls are registered on-chip
to initiate self-timed Write cycle. Write cycles can be one to
four bytes wide as controlled by the Write control inputs.
Individual byte Write allows individual byte to be written. BWa
controls DQa. BWb controls DQb. BWc controls DQc. BWd
controls DQd. BWa, BWb, BWc, and BWd can be active only
with BWE being LOW. GW being LOW causes all bytes to be
written. The x18 version only has 18 data inputs/outputs (DQa
and DQb) along with BWa and BWb (no BWc, BWd, DQc, and
DQd).
For the TQFP AJ and the BGA package versions, four pins are
used to implement JTAG test capabilities: Test Mode Select
(TMS), Test Data-In (TDI), Test Clock (TCK), and Test
Data-Out (TDO). The JTAG circuitry is used to serially shift
data to and from the device. JTAG inputs use LVTTL/LVCMOS
levels to shift data during this testing mode of operation. The
TA package version does not offer the JTAG capability.
The CY7C1361A and CY7C1363A operate from a +3.3V
power supply. All inputs and outputs are LVTTL-compatible.
360
6.5
10
San Jose
7C1361A-117
7C1363A-117
Flow-Thru Burst SRAM
320
7.0
2
10
and CE
CA 95134
2
), burst control inputs (ADSC,
7C1361A-100
7C1363A-100
Revised January 18, 2003
270
8.0
10
CY7C1361A
CY7C1363A
408-943-2600
2
chip enable
Unit
mA
mA
ns

Related parts for CY7C1361A-100AC

CY7C1361A-100AC Summary of contents

Page 1

... JTAG inputs use LVTTL/LVCMOS levels to shift data during this testing mode of operation. The TA package version does not offer the JTAG capability. The CY7C1361A and CY7C1363A operate from a +3.3V power supply. All inputs and outputs are LVTTL-compatible. 7C1361A-150 ...

Page 2

... BYTE d WRITE D Q ENABLE Input Register Address Register OUTPUT REGISTER CLR D Q Binary Counter & Logic [1] BYTE b WRITE D Q BYTE a WRITE D Q ENABLE Input Register Address Register OUTPUT REGISTER D Q CLR Binary Counter & Logic CY7C1361A CY7C1363A DQa,DQb DQc,DQd DQa,DQb Page ...

Page 3

... ZZ DQb 18 DQa 63 DQb 19 DQa 62 V CCQ CCQ DQb SS 22 DQa 59 DQb 23 DQa 58 DQb CCQ CCQ CY7C1361A CY7C1363A DQb 80 DQb 79 DQb CCQ DQb DQb 74 DQb 73 72 DQb CCQ 69 DQb DQb 100-pin TQFP Version ZZ 64 DQa 63 DQa CCQ DQa 59 DQa 58 DQa 57 DQa 56 ...

Page 4

... DQb DQb BWb ADV DQb V CLK DQb V BWE DQb MODE TMS TDI TCK CY7C1361A CY7C1363A CCQ DQb DQb SS V DQb DQb SS V DQb V SS CCQ BWb DQb DQb V DQb DQb CCQ V DQa DQa SS BWa DQa DQa V DQa V SS CCQ V DQa DQa ...

Page 5

... Linear Burst HIGH on this pin selects Interleaved Burst. ZZ Input- Sleep: This active HIGH input puts the device in Asynchronous low-power consumption standby mode. For normal operation, this input has to be either LOW or NC (No Connect). CY7C1361A CY7C1363A Pin Description Page ...

Page 6

... Write control and burst control inputs on its rising edge. All synchronous inputs must meet set-up and hold times around the clock’s rising edge. CE Input- Chip Enable: This active LOW input is used to enable the Synchronous device and to gate ADSP. CY7C1361A CY7C1363A Pin Description Pin Description ...

Page 7

... A package version. V Supply Core Power Supply: +3.3V –5% and +10 Ground Ground: GND I/O Power Power Supply for the I/O circuitry CCQ Supply NC – No Connect: These signals are not internally connected. User can leave it floating or connect CY7C1361A CY7C1363A Pin Description Page ...

Page 8

... CY7C1361A CY7C1363A Second Third Fourth Address Address Address (internal) (internal) (internal) A...A01 A...A10 A...A11 A...A10 A...A11 A...A00 A...A11 A...A00 A...A01 A...A00 A...A01 A...A10 Write OE CLK L-H High L-H High L-H High L-H High L-H High L L-H High L L L-H High L-H ...

Page 9

... Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the “sleep” mode. CEs for the duration of t Description Test Conditions ZZ > > V CY7C1361A CY7C1363A BWb BWc ...

Page 10

... The first column defines the bit’s position in the boundary scan register. The MSB of the register is connected to TDI, and LSB is connected to TDO. The second column is the signal name, the third column is the TQFP pin number, and the fourth column is the BGA bump number. CY7C1361A CY7C1363A ) ...

Page 11

... TAP controller is in the Shift-DR state, the bypass register is placed between TDI and TDO. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path. Reserved Do not use these instructions. They are reserved for future use. CY7C1361A CY7C1363A plus t ). The CS CH Page ...

Page 12

... The “0”/”1” next to each state represents the value at TMS at the rising edge of TCK. Document #: 38-05259 Rev SELECT DR-SCAN 0 1 CAPTURE-DR 0 SHIFT- EXIT1- PAUSE- EXIT2-DR 1 UPDATE- Figure 1. TAP Controller State Diagram CY7C1361A CY7C1363A SELECT IR-SCAN 0 1 CAPTURE-IR 0 SHIFT-IR 1 EXIT1-IR 0 PAUSE- EXIT2-IR 1 UPDATE- [11] Page ...

Page 13

... I = 100 A OHC [13 8.0 mA OLT [13 8.0 mA OHT /2; undershoot: V (AC) < – 0.5V for t < t KHKH IL KHKH must not exceed V . Control input signals (such as R/W, ADV/LD) may not have pulse widths less than t CC CY7C1361A CY7C1363A 0 Selection Circuitry [12] Min. Max. 2 0.3 CC –0.3 0.8 – ...

Page 14

... CH 17. Test conditions are specified using the load in TAP AC test conditions. Document #: 38-05259 Rev. *C [16, 17] Over the Operating Range Description THTL t THTH t t MVTH THMX t DVTH t THDX t TLQV t TLQX CY7C1361A CY7C1363A Min. Max ALL INPUT PULSES 3.0V 1.5V 1.5 ns 1.5 ns (b) t ...

Page 15

... Do not use these instructions; they are reserved for future use. 111 Places the bypass register between TDI and TDO. This instruction does not affect device operations. CY7C1361A CY7C1363A Description Reserved for revision number. Defines depth of 256K or 512K words. Defines width of x36 or x18 bits. ...

Page 16

... CY7C1361A CY7C1363A (continued) Signal Name TQFP Bump BWa 93 BWb 94 5G BWc 95 3G BWd 100 2A DQc 1 2D DQc 2 1E DQc 3 DQc 6 1G DQc 7 2H DQc 8 1D DQc 9 2E DQc 12 2G DQc DQd 18 2K DQd 19 DQd 22 2M DQd 23 1N DQd 24 2P DQd 25 1K ...

Page 17

... ADV 22 ADSP 23 ADSC BWE 26 GW Document #: 38-05259 Rev. *C Boundary Scan Order (512K × 18) Bit# Bump CY7C1361A CY7C1363A (continued) Signal Name TQFP Bump ID CLK BWa 93 BWb 100 DQb 8 1D DQb 9 DQb 12 2G DQb DQb 18 DQb 19 DQb 22 2M DQb 23 1N DQb 24 MODE Page ...

Page 18

... Device deselected; all inputs < > all inputs static Max. CLK frequency = 0 CC Description Test Conditions T = 25° MHz 3.3V CC pins should be no greater than 200 mV. CC < – 2.0V for t < CY7C1361A CY7C1363A Ambient [18] [19,20,21] Temperature 3.3V–5/ +10% – Min. Max. 2 2.0 1.7 –0.3 –0.3 – ...

Page 19

... CCQ V = 2.5V 4.5 CCQ [15, 23, 28] 0 [15, 23, 28] 3.5 [30] 1.5 [30] 0.5 is less than t and t is less than t KQHZ KQLZ OEHZ CY7C1361A CY7C1363A TQFP Typ 200us Vcctyp 90% Vccmin 10% 1 V/ns (c) (d) 133 MHz 117 MHz 100 MHz Min. Max. Min. Max. ...

Page 20

... For the X18 product, there are only BWa and BWb for byte Write control. Document #: 38-05259 Rev OEQ OELZ Q(A1) Q(A2) Q(A2+1) SINGLE READ , and CE are active CY7C1361A CY7C1363A Q(A2+2) Q(A2+3) Q(A2) BURST READ is only available for A package version. 2 Page Q(A2+1) Q(A2 ...

Page 21

... CLK t S ADSP ADSC t S ADDRESS A1 t BWa, BWb, [31] [29] BWc, BWd, BWE GW [32] [30] CE ADV OE t KQX DQ Q SINGLE WRITE Document #: 38-05259 Rev OEHZ D(A1) D(A2) D(A2+2) BURST WRITE CY7C1361A CY7C1363A D(A2+2) D(A2+2) D(A2+3) D(A3) D(A3+1) D(A3+2) BURST WRITE Page ...

Page 22

... Read/Write Timing CLK t S ADSP ADSC ADDRESS A2 t BWa, BWb, [31] [29] BWc, BWd, BWE, GW [32] [30] CE ADV OE DQ Q(A1) Single Reads Document #: 38-05259 Rev Q(A2) D(A3) Single Write CY7C1361A CY7C1363A A5 Q(A4) Q(A4+1) Q(A4+2) Q(A4+3) D(A5) Burst Read D(A5+1) Burst Write Page ...

Page 23

... Speed (MHz) Ordering Code 150 CY7C1361A-150AJC CY7C1361A-150AC CY7C1361A-150BGC 133 CY7C1361A-133AJC CY7C1361A-133AC CY7C1361A-133BGC 117 CY7C1361A-117AJC CY7C1361A-117AC CY7C1361A-117BGC 100 CY7C1361A-100AJC CY7C1361A-100AC CY7C1361A-100BGC Document #: 38-05259 Rev ZZS I (active Three-state Package Name A101 100-lead 1.4 mm Thin Quad Flat Pack A101 100-lead 1.4 mm Thin Quad Flat Pack BG119 119-ball BGA ( ...

Page 24

... CY7C1363A-133AC CY7C1363A-133BGC 117 CY7C1363A-117AJC CY7C1363A-117AC CY7C1363A-117BGC 100 CY7C1363A-100AJC CY7C1363A-100AC CY7C1363A-100BGC 133 CY7C1361A-133AJI CY7C1361A-133AI CY7C1361A-133BGI 117 CY7C1361A-117AJI CY7C1361A-117AI CY7C1361A-117BGI 100 CY7C1361A-100AJI CY7C1361A-100AI CY7C1361A-100BGI 133 CY7C1363A-133AJI CY7C1363A-133AI CY7C1363A-133BGI 117 CY7C1363A-117AJI CY7C1363A-117AI CY7C1363A-117BGI 100 CY7C1363A-100AJI CY7C1363A-100AI CY7C1363A-100BGI Document #: 38-05259 Rev. *C Package Name Package Type A101 100-lead ...

Page 25

... Package Diagrams 100-lead Thin Plastic Quad Flatpack ( 1.4 mm) A101 Document #: 38-05259 Rev. *C CY7C1361A CY7C1363A 51-85050-*A Page ...

Page 26

... The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. 119-Lead BGA ( 2.4) BG119 CY7C1361A CY7C1363A 51-85115-*A ...

Page 27

... Document Title:CY7C1361A/CY7C1363A 256K x 36/512K x 18 Synchronous Flow-Thru Burst SRAM Document Number: 38-05259 REV ECN No. Issue Date ** 113847 05/17/02 *A 116225 06/20/02 *B 117836 09/12/02 *C 123145 01/18/03 Document #: 38-05259 Rev. *C Orig. of Description of Change Change GLC New Data Sheet BRI Removed GVT part numbers from title and body of data sheet ...

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