CY7C1355C-100AXCT Cypress Semiconductor Corp, CY7C1355C-100AXCT Datasheet - Page 27

• Manufacturer Part Number: CY7C1355C-100AXCT
• Description: IC SRAM 9MBIT 100MHZ 100LQFP
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1355C-100AXCT

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 9M (256K x 36)
• Speed: 100MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Diagrams
NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device
Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders
Document #: 38-05539 Rev. *E
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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PIN 1 CORNER
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SEATING PLANE
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SEATING PLANE
(continued)
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13.00±0.10
TOP VIEW
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TOP VIEW
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165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
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165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
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0.15(4X)
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JEDEC REFERENCE : MO-216 / DESIGN 4.6C
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
PACKAGE CODE : BB0AC
NOTES :
B
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JEDEC REFERENCE : MO-216 / DESIGN 4.6C
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
PACKAGE CODE : BB0AC
NOTES :
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5.00
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BOTTOM VIEW
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13.00±0.10
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BOTTOM VIEW
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13.00±0.10
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Ø0.50 (165X)
Ø0.05 M C
Ø0.25 M C A B
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10.00
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51-85180-*A
-0.06
+0.14
Ø0.50
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Ø0.05 M C
Ø0.25 M C A B
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1.00
PIN 1 CORNER
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-
+0.14
0.06
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51-85180-*A
PIN 1 CORNER
(165X)
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1
CY7C1355C
CY7C1357C
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