CY7C1471V33-133AXCT Cypress Semiconductor Corp, CY7C1471V33-133AXCT Datasheet - Page 24

• Manufacturer Part Number: CY7C1471V33-133AXCT
• Description: IC SRAM 72MBIT 133MHZ 100LQFP
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1471V33-133AXCT

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 72M (2M x 36)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Capacitance
Tested initially and after any design or process change that may affect these parameters.
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
AC Test Loads and Waveforms
Document Number: 38-05288 Rev. *L
C
C
C
C
C
OUTPUT
OUTPUT
ADDRESS
DATA
CTRL
CLK
IO
Parameter
3.3 V IO Test Load
Parameter
2.5 V IO Test Load


JC
JA
Z
Z
0
0
= 50 
= 50 
Address input capacitance
Data input capacitance
Control input capacitance
Clock input capacitance
Input/output capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
(a)
(a)
V
V
L
L
Description
= 1.25 V
= 1.5 V
Description
R
R
L
L
= 50 
= 50 
OUTPUT
OUTPUT
3.3 V
2.5 V
INCLUDING
INCLUDING
JIG AND
JIG AND
SCOPE
SCOPE
5 pF
5 pF
T
A
Test Conditions
= 25 C, f = 1 MHz,
Test conditions follow
standard test methods
and procedures for
measuring thermal
impedance, according to
EIA/JESD51.
V
V
DDQ
DD
Test Conditions
(b)
(b)
R = 317 
R = 1667 
= 3.3 V
= 2.5 V
R = 351 
R = 1538 
V
100 TQFP
Package
V
GND
GND
DDQ
DDQ
 1 ns
 1 ns
6
5
8
6
5
100 TQFP
24.63
Max
2.28
10%
10%
165 FBGA
Package
ALL INPUT PULSES
ALL INPUT PULSES
6
5
8
6
5
165 FBGA
90%
90%
Max
16.3
2.1
(c)
(c)
209 BGA
Package
CY7C1471V33
CY7C1473V33
CY7C1475V33
209 FBGA
6
5
8
6
5
Max
15.2
1.7
90%
90%
10%
10%
Page 24 of 36
 1 ns
 1 ns
Unit
pF
pF
pF
pF
pF
C/W
C/W
Unit
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