W25X64VSFIG Winbond Electronics, W25X64VSFIG Datasheet - Page 3

• Manufacturer Part Number: W25X64VSFIG
• Description: IC FLASH 64MBIT 75MHZ 16SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X64VSFIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 64M (8M x 8)
• Speed: 75MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13.
14.
15.
16.
ELECTRICAL CHARACTERISTICS......................................................................................... 33
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
13.9
13.10
PACKAGE SPECIFICATION .................................................................................................... 40
14.1
14.2
14.3
14.4
14.5
14.6
ORDERING INFORMATION .................................................................................................... 47
REVISION HISTORY ................................................................................................................ 49
12.2.2
12.2.3
12.2.4
12.2.5
12.2.6
12.2.7
12.2.8
12.2.9
12.2.10
12.2.11
12.2.12
12.2.13
12.2.14
12.2.15
12.2.16
12.2.17
Absolute Maximum Ratings .......................................................................................... 33
Operating Ranges......................................................................................................... 33
Endurance and Data Retention .................................................................................... 34
Power-up Timing and Write Inhibit Threshold .............................................................. 34
DC Electrical Characteristics ........................................................................................ 35
AC Measurement Conditions........................................................................................ 36
AC Electrical Characteristics ........................................................................................ 37
Serial Output Timing ..................................................................................................... 39
Input Timing .................................................................................................................. 39
8-Pin SOIC 150-mil (Package Code SN)...................................................................... 40
8-Pin SOIC 208-mil (Package Code SS)...................................................................... 41
8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 42
8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 43
8-Contact 8x6mm WSON (Package Code ZE) ............................................................ 45
16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 46
Hold Timing ................................................................................................................. 39
Instruction Set...............................................................................................................17
Write Enable (06h)........................................................................................................18
Write Disable (04h).......................................................................................................18
Read Status Register (05h) ..........................................................................................19
Write Status Register (01h) ..........................................................................................20
Read Data (03h) ...........................................................................................................21
Fast Read (0Bh) ...........................................................................................................22
Fast Read Dual Output (3Bh) .......................................................................................23
Page Program (02h) ...................................................................................................24
Sector Erase (20h) .....................................................................................................25
Block Erase (D8h) ......................................................................................................26
Chip Erase (C7h)........................................................................................................27
Power-down (B9h) ......................................................................................................28
Release Power-down / Device ID (ABh) .....................................................................29
Read Manufacturer / Device ID (90h) .........................................................................31
JEDEC ID (9Fh)..........................................................................................................32
W25X16, W25X16A, W25X32, W25X64
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Publication Release Date: may 5, 2008
Revision I