W25X64VSFIG Winbond Electronics, W25X64VSFIG Datasheet - Page 31
W25X64VSFIG
Manufacturer Part Number
W25X64VSFIG
Description
IC FLASH 64MBIT 75MHZ 16SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25X16AVDAIZ.pdf
(50 pages)
Specifications of W25X64VSFIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
64M (8M x 8)
Speed
75MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
16-SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
W25X64VSFIG
Manufacturer:
Winbond
Quantity:
84
Company:
Part Number:
W25X64VSFIG
Manufacturer:
HBa
Quantity:
177
Part Number:
W25X64VSFIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
W25X16, W25X16A, W25X32, W25X64
12.2.16 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device
ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond
(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first
as shown in figure 18. The Device ID values for the W25X16/16A, W25X32, AND W25X64 are listed
in Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the
Device ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device
IDs can be read continuously, alternating from one to the other. The instruction is completed by driving
/CS high.
Figure 18. Read Manufacturer / Device ID Diagram
Publication Release Date: may 5, 2008
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Revision I