TE28F320C3BD70 Intel, TE28F320C3BD70 Datasheet - Page 4
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TE28F320C3BD70
Manufacturer Part Number
TE28F320C3BD70
Description
IC FLASH 32MBIT 70NS 48TSOP
Manufacturer
Intel
Specifications of TE28F320C3BD70
Rohs Status
RoHS non-compliant
Format - Memory
FLASH
Memory Type
Advanced + Boot Block FLASH
Memory Size
32M (2M x 16)
Speed
70ns
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP
Other names
855810
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TE28F320C3BD70
Manufacturer:
SAMSUNG
Quantity:
6 000
Part Number:
TE28F320C3BD70
Manufacturer:
INFTEL
Quantity:
20 000
Contents
6.0
7.0
8.0
Appendix A Write State Machine States.............................................................................................50
Appendix B Flow Charts ......................................................................................................................52
Appendix C Common Flash Interface.................................................................................................58
Appendix D Mechanical Specifications..............................................................................................64
Appendix E Additional Information ....................................................................................................67
Appendix F Ordering Information .......................................................................................................68
4
Power Consumption.................................................................................................................... 32
6.1
6.2
6.3
6.4
6.5
6.6
Thermal and DC Characteristics ................................................................................................ 34
7.1
7.2
7.3
7.4
AC Characteristics ...................................................................................................................... 39
8.1
8.2
8.3
8.4
8.5
8.6
5.6.1
Active Power (Program/Erase/Read).................................................................................. 32
Automatic Power Savings (APS) ........................................................................................ 32
Standby Power ................................................................................................................... 32
Deep Power-Down Mode.................................................................................................... 32
Power and Reset Considerations ....................................................................................... 33
6.5.1
6.5.2
6.5.3
Power Supply Decoupling................................................................................................... 34
Absolute Maximum Ratings ................................................................................................ 34
Operating Conditions .......................................................................................................... 35
DC Current Characteristics................................................................................................. 35
DC Voltage Characteristics................................................................................................. 38
AC Read Characteristics .................................................................................................... 39
AC Write Characteristics..................................................................................................... 43
Erase and Program Timings ............................................................................................... 47
Reset Specifications ........................................................................................................... 48
AC I/O Test Conditions ....................................................................................................... 49
Device Capacitance............................................................................................................ 49
Program Protection................................................................................................ 31
Power-Up/Down Characteristics............................................................................ 33
RP# Connected to System Reset .......................................................................... 33
VCC, VPP and RP# Transitions ............................................................................ 33
Datasheet