MD4331-D1G-V3Q18-X/Y SanDisk, MD4331-D1G-V3Q18-X/Y Datasheet - Page 11

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MD4331-D1G-V3Q18-X/Y

Manufacturer Part Number
MD4331-D1G-V3Q18-X/Y
Description
IC MDOC G3 1GB 69-FBGA
Manufacturer
SanDisk
Datasheet

Specifications of MD4331-D1G-V3Q18-X/Y

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
1G (128M x 8)
Speed
55ns
Interface
Parallel
Voltage - Supply
2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
585-1134

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MD4331-D1G-V3Q18-X/Y
Manufacturer:
SanDisk
Quantity:
10 000
2.2
2.2.1 Pin/Ball Diagrams
See Figure 1 and Figure 2 for the Mobile DiskOnChip G3 512Mb pinout/ballout for the standard
interface. To ensure proper device functionality, pins/balls marked RSRVD are reserved for future
use and should not be connected.
Note: Third-generation Mobile DiskOnChip G3 is designed as a drop-in replacement for
TSOP-I Package
8
DMARQ#
RSTIN#
A0/DPD
IF_CFG
RSRVD
LOCK#
second-generation (G2) DiskOnChip Plus products, assuming that the latter were integrated
according to migration guide guidelines. Refer to application note AP-DOC-067, Preparing
your PCB Footprint for the DiskOnChip BGA Migration Path, for further information.
WE#
VCC
OE#
VSS
CE#
A12
A11
A10
ID0
512Mb Standard Interface
A9
A8
A7
A6
A5
A4
A3
A2
A1
Figure 1: TSOP-I Pinout for Standard Interface (Mobile DiskOnChip G3 512Mb)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Mobile DiskOnChip G3 512Mb (64MB)
Preliminary Data Sheet, Rev. 1.1
48-Pin TSOP-I
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
Mobile DiskOnChip G3
91-SR-011-05-8L
VSS
IRQ#
D15
D14
D13
D12
D11
D10
D9
D8
CLK
VCCQ
VSS
D7
D6
D5
D4
D3
D2
D1
D0
BUSY#
ID1
VSS

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