MD4331-D1G-V3Q18-X/Y SanDisk, MD4331-D1G-V3Q18-X/Y Datasheet - Page 29
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MD4331-D1G-V3Q18-X/Y
Manufacturer Part Number
MD4331-D1G-V3Q18-X/Y
Description
IC MDOC G3 1GB 69-FBGA
Manufacturer
SanDisk
Datasheet
1.MD4331-D1G-V3Q18-X-PY.pdf
(97 pages)
Specifications of MD4331-D1G-V3Q18-X/Y
Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
1G (128M x 8)
Speed
55ns
Interface
Parallel
Voltage - Supply
2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
585-1134
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MD4331-D1G-V3Q18-X/Y
Manufacturer:
SanDisk
Quantity:
10 000
2.5
2.5.1 Ball Diagram
See Figure 9 for the Mobile DiskOnChip G3 1Gb (dual-die) ball diagram. To ensure proper device
functionality, balls marked RSRVD are reserved for future use and should not be connected.
Note: Mobile DiskOnChip G3 1Gb is designed as a drop-in replacement for Mobile DiskOnChip
9x12 FBGA Package
26
G3 512Mb, assuming that the board was designed according to the migration guide
guidelines. Refer to application note AP-DOC-067, Preparing your PCB Footprint for the
DiskOnChip BGA Migration Path, for further information.
1Gb Multiplexed Interface
Figure 9: Ballout for Multiplexed Interface (Mobile DiskOnChip G3 1Gb 9x12 FBGA Package)
M
A
B
C
D
G
H
K
E
F
J
L
1
M
M
M
M
M
M
A
RSRVD
VSS
VSS
VSS
DPD
CE#
2
VSS
VSS
VSS
VSS
VSS
OE#
AD0
AD8
3
RSRVD
RSRVD
RSRVD
Preliminary Data Sheet, Rev. 1.1
VCCQ
AD10
AD1
AD9
AD2
4
RSRVD
RSTIN#
BUSY#
AD11
VCC
AD3
5
RSRVD
RSRVD
VCCQ
WE#
AD4
CLK
6
RSRVD
AD13
AD12
VSS
VSS
VSS
AD6
AD5
7
DMARQ#
ID0(VSS)
LOCK#
AD15
AD14
VSS
VSS
AD7
8
RSRVD
RSRVD
RSRVD
AVD#
IRQ#
VSS
9
Mobile DiskOnChip G3
10
M
M
M
M
M
M
91-SR-011-05-8L