MD4832-D512-V3Q18-X-P/Y SanDisk, MD4832-D512-V3Q18-X-P/Y Datasheet - Page 6
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MD4832-D512-V3Q18-X-P/Y
Manufacturer Part Number
MD4832-D512-V3Q18-X-P/Y
Description
IC MDOC G3 512MB 85-FBGA
Manufacturer
SanDisk
Datasheet
1.MD4331-D1G-V3Q18-X-PY.pdf
(97 pages)
Specifications of MD4832-D512-V3Q18-X-P/Y
Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
512M (64M x 8)
Speed
55ns
Interface
Parallel
Voltage - Supply
2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
585-1139
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MD4832-D512-V3Q18-X-P/Y
Manufacturer:
SanDisk
Quantity:
10 000
4. x2 Technology ......................................................................................................................... 37
5. Hardware Protection ............................................................................................................... 41
6. Modes of Operation................................................................................................................. 44
7. Register Descriptions ............................................................................................................. 51
3
3.8
3.9
3.10 Flash Architecture............................................................................................................. 35
4.1
4.2
4.3
4.4
5.1
5.2
6.1
6.2
6.3
6.4
6.5
7.1
7.2
7.3
7.4
7.5
7.6
7.7
Data Pipeline .................................................................................................................... 34
Control and Status............................................................................................................ 35
MultiBurst Operation......................................................................................................... 37
DMA Operation................................................................................................................. 39
Combined MultiBurst Mode and DMA Operation ............................................................. 40
Turbo Operation ............................................................................................................... 40
Method of Operation......................................................................................................... 41
Low-Level Structure of the Protected Area....................................................................... 42
Normal Mode .................................................................................................................... 45
Reset Mode ...................................................................................................................... 45
Deep Power-Down Mode ................................................................................................. 45
TrueFFS Technology........................................................................................................ 46
6.4.1
6.4.2
6.4.3
6.4.4
6.4.5
6.4.6
6.4.7
6.4.8
6.4.9
6.4.10 Compatibility ....................................................................................................................... 49
8KB Memory Window ....................................................................................................... 49
Definition of Terms ........................................................................................................... 51
Reset Values .................................................................................................................... 51
No Operation (NOP) Register........................................................................................... 52
Chip Identification (ID) Register [0:1]................................................................................ 52
Test Register .................................................................................................................... 52
Bus Lock Register ............................................................................................................ 53
Endian Control Register ................................................................................................... 54
General Description............................................................................................................ 46
Built-In Operating System Support..................................................................................... 47
TrueFFS Software Development Kit (SDK)........................................................................ 47
File Management................................................................................................................ 47
Bad Block Management ..................................................................................................... 47
Wear-Leveling .................................................................................................................... 47
Power Failure Management ............................................................................................... 48
Error Detection/Correction.................................................................................................. 49
Special Features Through I/O Control (IOCTL) Mechanism.............................................. 49
Preliminary Data Sheet, Rev. 1.1
Mobile DiskOnChip G3
91-SR-011-05-8L