MD2533-D8G-X-P/Y SanDisk, MD2533-D8G-X-P/Y Datasheet - Page 55

• Manufacturer Part Number: MD2533-D8G-X-P/Y
• Description: IC MDOC H3 8GB FBGA
• Manufacturer: SanDisk
• Type: Flash Disk Moduler

Specifications of MD2533-D8G-X-P/Y

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 8G (1G x 8)
• Interface: Parallel
• Voltage - Supply: 1.65 V ~ 1.95 V, 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 115-LFBGA
• Density: 1GByte
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Package Type: FBGA
• Mounting: Surface Mount
• Pin Count: 115
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.65/2.7V
• Operating Supply Voltage (max): 1.95/3.6V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Speed: -
• Lead Free Status / Rohs Status: Compliant

9.
9.1
9.2
The Configuration and GPIO Interface enables the designer to configure mDOC H3 to operate in
different modes and to use the GPIO for predefined purposes.
• The ID0 signal is used in a cascaded configuration.
• The LOCK# signal is used for hardware write/read protection
• GPIO_TIMER signal is a predefined timer waveform with vary frequency and duty cycle
• WARM_RST# signal (Warm reset) is used for triggering device warm-reset of mDOC H3.
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• A typical RISC processor memory architecture may include the following devices:
• mDOC H3: Contains the OS image, applications, registry entries, back-up data, user files
•
• Boot Device: In case mDOC H3 is not used as a boot device, ROM or NOR flash that
• RAM/DRAM Memory: This memory is used for code execution.
• Other Devices: A DSP processor, for example, may be used in a RISC architecture for
D
General Guidelines
and data, etc. It can also be used to perform boot operation, thereby replacing the need for
a separate boot device.
CPU: mDOC H3 is compatible with all major CPUs in the mobile phone,
(DTV), Digital Still Camera (DSC), MP3, GPS and other
Applications markets, including:
o ARM-based CPUs
o Texas Instruments OMAP, DBB
o Intel PXAxxx family
o Infineon xGold family
o Analog Devices (ADI) digital Baseband devices
o Freescale i.MXxx Application processors and i.xx digital Baseband devices
o Zoran ER4525
o Renesas SH mobile
o EMP platforms
o Qualcomm MSMxxxx
contains the boot code is required for system initialization, kernel relocation, loading the
operating systems and/or other applications and files into the RAM and executing them.
enhanced multimedia support.
Configuration and GPIO Interface
ESIGN
C
ONSIDERATIONS
Data Sheet (Preliminary) Rev. 0.2
Portable Consumer Electronics
mDOC H3 Embedded Flash Drive
Digital TV
92-DS-1205-10