SDED7-512M-NAY SanDisk, SDED7-512M-NAY Datasheet - Page 8

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SDED7-512M-NAY

Manufacturer Part Number
SDED7-512M-NAY
Description
IC MDOC H3 512MB FBGA
Manufacturer
SanDisk
Datasheets

Specifications of SDED7-512M-NAY

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
4G (512M x 8)
Interface
Parallel
Voltage - Supply
1.65 V ~ 1.95 V
Operating Temperature
-25°C ~ 85°C
Package / Case
115-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SDED7-512M-NAY
Manufacturer:
SanDisk
Quantity:
10 000
Part Number:
SDED7-512M-NAY EOL
Manufacturer:
SANDISK
Quantity:
18 445
Rev. 1.2
T
1.  Introduction..............................................................................................................................12 
2.  Product Overview ....................................................................................................................13 
3.  Theory of Operation ................................................................................................................25 
4.  Data Protection and Security-Enabling features ..................................................................29 
5.  mDOC H3 Modes of Operation ...............................................................................................31 
8
ABLE OF
2.1  Product Description ..........................................................................................................13 
2.2  Demux (Standard) Interface .............................................................................................14 
2.3  Multiplexed Interface.........................................................................................................19 
3.1  Overview...........................................................................................................................25 
3.2  Host Interface ...................................................................................................................26 
3.3  Host Agent ........................................................................................................................27 
3.4  Boot Agent ........................................................................................................................27 
3.5  Error Detection Code/Error Correction Code (EDC/ECC) ................................................28 
3.6  Block Device Management ...............................................................................................28 
5.1  Reset State .......................................................................................................................32 
5.2  Turbo Mode ......................................................................................................................32 
5.3  Power Save Mode ............................................................................................................32 
5.4  Standby Mode...................................................................................................................32 
5.5  Deep Power-Down Mode..................................................................................................33 
2.2.1
2.2.2
2.2.3
2.3.1
2.3.2
2.3.3
3.2.1
3.2.2
3.2.3
3.3.1
3.3.2
4.1.1
4.1.2
4.1.3
4.1.4
4.1.5
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
C
ONTENTS
9x12/10x14/12x18 FBGA Ball Diagrams ............................................................................14
9x12/10x14/12x18 FBGA Signal Description......................................................................16
System Interface .................................................................................................................19
9x12/10x14/12x18 FBGA Ball Diagram ..............................................................................19
9x12/10x14/12x18 FBGA Signal Description......................................................................21
System Interface .................................................................................................................23
Demux (NOR-Like) Interface...............................................................................................26
Multiplexed Interface ...........................................................................................................26
Serial Interface ....................................................................................................................27
Host Protocol.......................................................................................................................27
Boot Block (XIP)..................................................................................................................27
Read/Write-Protected partitions ..........................................................................................29
LOCK# signal ......................................................................................................................29
Sticky Lock (SLOCK) ..........................................................................................................29
Unique Identification (UID) Number ....................................................................................30
One-Time Programmable (OTP) Partitions.........................................................................30
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
92-DS-1205-10
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

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