SDED5-004G-NCY SanDisk, SDED5-004G-NCY Datasheet - Page 8

• Manufacturer Part Number: SDED5-004G-NCY
• Description: IC MDOC H3 4GB FBGA
• Manufacturer: SanDisk
• Type: Flash Disk Moduler

Specifications of SDED5-004G-NCY

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 32G (4G x 8)
• Interface: Parallel
• Voltage - Supply: 1.65 V ~ 1.95 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 115-FBGA
• Density: 4GByte
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Temperature (min): -25C
• Operating Temperature (max): 85C
• Package Type: FBGA
• Mounting: Surface Mount
• Pin Count: 115
• Operating Temperature Classification: Commercial
• Operating Supply Voltage (min): 1.65/2.7V
• Operating Supply Voltage (max): 1.95/3.6V
• Programmable: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Speed: -
• Lead Free Status / Rohs Status: Compliant

Rev. 1.2
T
1. Introduction..............................................................................................................................12
2. Product Overview ....................................................................................................................13
3. Theory of Operation ................................................................................................................25
4. Data Protection and Security-Enabling features ..................................................................29
5. mDOC H3 Modes of Operation ...............................................................................................31
8
ABLE OF
2.1 Product Description ..........................................................................................................13
2.2 Demux (Standard) Interface .............................................................................................14
2.3 Multiplexed Interface.........................................................................................................19
3.1 Overview...........................................................................................................................25
3.2 Host Interface ...................................................................................................................26
3.3 Host Agent ........................................................................................................................27
3.4 Boot Agent ........................................................................................................................27
3.5 Error Detection Code/Error Correction Code (EDC/ECC) ................................................28
3.6 Block Device Management ...............................................................................................28
5.1 Reset State .......................................................................................................................32
5.2 Turbo Mode ......................................................................................................................32
5.3 Power Save Mode ............................................................................................................32
5.4 Standby Mode...................................................................................................................32
5.5 Deep Power-Down Mode..................................................................................................33
2.2.1
2.2.2
2.2.3
2.3.1
2.3.2
2.3.3
3.2.1
3.2.2
3.2.3
3.3.1
3.3.2
4.1.1
4.1.2
4.1.3
4.1.4
4.1.5
C
ONTENTS
9x12/10x14/12x18 FBGA Ball Diagrams ............................................................................14
9x12/10x14/12x18 FBGA Signal Description......................................................................16
System Interface .................................................................................................................19
9x12/10x14/12x18 FBGA Ball Diagram ..............................................................................19
9x12/10x14/12x18 FBGA Signal Description......................................................................21
System Interface .................................................................................................................23
Demux (NOR-Like) Interface...............................................................................................26
Multiplexed Interface ...........................................................................................................26
Serial Interface ....................................................................................................................27
Host Protocol.......................................................................................................................27
Boot Block (XIP)..................................................................................................................27
Read/Write-Protected partitions ..........................................................................................29
LOCK# signal ......................................................................................................................29
Sticky Lock (SLOCK) ..........................................................................................................29
Unique Identification (UID) Number ....................................................................................30
One-Time Programmable (OTP) Partitions.........................................................................30
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
92-DS-1205-10