SDED5-512M-N9T SanDisk, SDED5-512M-N9T Datasheet - Page 10
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SDED5-512M-N9T
Manufacturer Part Number
SDED5-512M-N9T
Description
IC MDOC H3 4GB 115-FBGA
Manufacturer
SanDisk
Specifications of SDED5-512M-N9T
Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
4G (512M x 8)
Interface
Parallel
Voltage - Supply
1.65 V ~ 1.95 V
Operating Temperature
-25°C ~ 85°C
Package / Case
115-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Other names
585-1236-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SDED5-512M-N9T
Manufacturer:
SANDISK
Quantity:
18 385
Rev. 1.3
10. Product Specifications............................................................................................................64
10
9.5
9.6
9.7
9.8
9.9
9.10 Platform-Specific Issues ...................................................................................................61
9.11 Design Environment .........................................................................................................63
10.1 Environmental Specifications............................................................................................64
10.2 Electrical Specifications ....................................................................................................64
10.3 Timing Specifications........................................................................................................68
mDOC H3 Power Supply Connectivity .............................................................................51
Connecting Control Signals ..............................................................................................55
9.6.1
9.6.2
Implementing the Interrupt Mechanism ............................................................................56
9.7.1
9.7.2
DMA and Burst Operation.................................................................................................56
9.8.1
9.8.2
Device Cascading.............................................................................................................60
9.10.1 Wait State............................................................................................................................61
9.10.2 Big and Little Endian Systems ............................................................................................61
9.10.3 Busy Signal .........................................................................................................................61
9.10.4 Working with 16/32-Bit Systems .........................................................................................61
10.1.1 Operating Temperature.......................................................................................................64
10.1.2 Thermal Characteristics ......................................................................................................64
10.1.3 Humidity ..............................................................................................................................64
10.2.1 Absolute Maximum Ratings ................................................................................................64
10.2.2 Capacitance ........................................................................................................................65
10.2.3 DC Characteristics ..............................................................................................................65
10.3.1 Operating Conditions ..........................................................................................................68
10.3.2 Demux Asynchronous Read Timing ...................................................................................69
10.3.3 Demux Asynchronous Write Timing....................................................................................70
10.3.4 Multiplexed Asynchronous Read Timing.............................................................................70
10.3.5 Multiplexed Asynchronous Write Timing.............................................................................71
10.3.6 Demux Burst Read Timing ..................................................................................................72
10.3.7 Demux Burst Write Timing ..................................................................................................73
10.3.8 Multiplexed Burst Read Timing ...........................................................................................74
10.3.9 DMA Request Timing Diagram ...........................................................................................75
10.3.10 SPI Timing...........................................................................................................................76
10.3.11 Power Supply Sequence.....................................................................................................77
10.3.12 Power-Up Timing ................................................................................................................77
Demux Interface..................................................................................................................55
Multiplexed Interface ...........................................................................................................55
Hardware Configuration ......................................................................................................56
Software Configuration........................................................................................................56
DMA Operation ...................................................................................................................56
Synchronous Burst Operation .............................................................................................57
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
92-DS-1205-10