PCF8578T/1,118 NXP Semiconductors, PCF8578T/1,118 Datasheet - Page 2

• Manufacturer Part Number: PCF8578T/1,118
• Description: IC LCD DRIVER ROW/COLUMN 56-VSOP
• Manufacturer: NXP Semiconductors

Specifications of PCF8578T/1,118

• Package / Case: 56-VSOP
• Display Type: LCD
• Configuration: Dot Matrix
• Interface: I²C
• Voltage - Supply: 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Digits: 24
• Number Of Segments: 7
• Maximum Clock Frequency: 3.3 KHz
• Operating Supply Voltage: 2.5 V to 6 V
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 150 C
• Attached Touch Screen: No
• Maximum Supply Current: 50 mA
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Details
• Other names: 935278868118; PCF8578TD-T; PCF8578TD-T

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
7.17
8
8.1
9
9.1
9.2
9.3
9.4
10
11
12
13
14
15
16
17
2003 Apr 14
LCD row/column driver for
dot matrix graphic displays
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Mixed mode
Row mode
Multiplexed LCD bias generation
Power-on reset
Internal clock
External clock
Timing generator
Row/column drivers
Display mode controller
Display RAM
Data pointer
Subaddress counter
I
Input filters
RAM access
Display control
TEST pin
I
Command decoder
CHARACTERISTICS OF THE I
Bit transfer
Start and stop conditions
System configuration
Acknowledge
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
AC CHARACTERISTICS
CHIP DIMENSIONS AND BONDING PAD
LOCATIONS
CHIP-ON-GLASS INFORMATION
PACKAGE OUTLINES
2
2
APPLICATION INFORMATION
C-bus controller
C-BUS PROTOCOL
2
C-BUS
2
18
18.1
18.2
18.3
18.4
18.5
19
20
21
22
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
Product specification
2
C COMPONENTS
PCF8578