MAX4271ESA+ Maxim Integrated Products, MAX4271ESA+ Datasheet - Page 23

• Manufacturer Part Number: MAX4271ESA+
• Description: IC CNTRLR HOT SWAP 8-SOIC
• Manufacturer: Maxim Integrated Products
• Type: Hot-Swap Controllerr

Specifications of MAX4271ESA+

• Applications: General Purpose
• Internal Switch(s): No
• Voltage - Supply: 2.7 V ~ 13.2 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Product: Controllers & Switches
• Supply Voltage (max): 13.2 V
• Supply Voltage (min): 2.7 V
• Power Dissipation: 471 mW
• Operating Temperature Range: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 18. Kelvin Connections for the Current-Sense Resistors
with Autoretry, DualSpeed/BiLevel Fault Protection
Calculate the MOSFET thermal resistance required
for a short to ground.
Using t
Figure 17 to select a duty cycle. The duty cycle
should be about 0.01 or less. This implies t
t
TOP VIEW
START
Z
3V to 12V Current-Limiting Hot-Swap Controllers
θJA
/ 0.01 = 100ms. From Figure 8, C
START
= (150°C - 85°C) / (5V
SENSE
GATE
GND
IN
______________________________________________________________________________________
1
2
4
3
= 1ms as the pulse duration, use
MAX4271
MAX4272
MAX4273
HIGH-CURRENT PATH
MAX4271
MAX4272
SO
✕
8
7
6
5
10A) = 1.30°C/W
ON
STAT
CTIM
CSPD
SENSE RESISTOR
TIM
RETRY
= 10nF.
=
To take full tracking advantage of the switch response
time to an output fault condition, it is important to keep
all traces as short as possible and to maximize the
high-current trace dimensions to reduce the effect of
undesirable parasitic inductance. Place the MAX4271/
MAX4272/MAX4273 close to the card’s connector. Use
a ground plane to minimize impedance and induc-
tance. Minimize the current-sense resistor trace length
(<10mm), and ensure accurate current sensing with
Kelvin connections (Figure 18).
When the output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence,
the power dissipation across the switch increases, as
does the die temperature. An efficient way to achieve
good power dissipation on a surface-mount package is
to lay out two copper pads directly under the MOSFET
package on both sides of the board. Connect the two
pads to the ground plane through vias, and use
enlarged copper mounting pads on the top side of the
board.
AUXVCC
LLMON
SENSE
GATE
CEXT
GND
RTH
IN
1
2
3
4
5
6
7
8
QSOP/SO
MAX4273
Pin Configurations
Layout Considerations
16
15
14
13
12
11
10
9
OUTC
INC
REF
ON
STAT
CTIM
CSPD
CTON
23