LTC4301CMS8 Linear Technology, LTC4301CMS8 Datasheet - Page 11
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LTC4301CMS8
Manufacturer Part Number
LTC4301CMS8
Description
IC BUFFER BUS HOTSWAP 2WR 8MSOP
Manufacturer
Linear Technology
Type
Hot-Swap Switchr
Datasheet
1.LTC4301CMS8PBF.pdf
(12 pages)
Specifications of LTC4301CMS8
Applications
General Purpose, Buffer/Bus Extender
Internal Switch(s)
Yes
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC4301CMS8
Manufacturer:
LT
Quantity:
10 000
Part Number:
LTC4301CMS8#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LTC4301CMS8#TRPBF
Manufacturer:
MAXIM
Quantity:
6 220
Part Number:
LTC4301CMS8#TRPBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
PACKAGE DESCRIPTIO
(.0165 ± .0015)
3.5 ±0.05
0.42 ± 0.038
TYP
2.15 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
0.889 ± 0.127
(.0256)
(.035 ± .005)
(.126 – .136)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.65
3.20 – 3.45
BSC
0.50
BSC
U
GAUGE PLANE
PACKAGE
OUTLINE
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.675 ±0.05
0.18
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1660)
(Reference LTC DWG # 05-08-1698)
TOP MARK
(NOTE 6)
8-Lead Plastic MSOP
(.010)
0.254
PIN 1
0.200 REF
MS8 Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
DD Package
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
DETAIL “A”
DETAIL “A”
0° – 6° TYP
(.021 ± .006)
0.53 ± 0.152
SEATING
3.00 ±0.10
0.75 ±0.05
PLANE
(4 SIDES)
0.00 – 0.05
(.193 ± .006)
4.90 ± 0.152
(.118 ± .004)
3.00 ± 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
1.65 ± 0.10
(2 SIDES)
TYP
(.043)
1.10
MAX
BOTTOM VIEW—EXPOSED PAD
(.0256)
0.25 ± 0.05
R = 0.115
0.65
BSC
1
8
TYP
4
5
7 6 5
2 3
2.38 ±0.10
(2 SIDES)
4
LTC4301
(.118 ± .004)
3.00 ± 0.102
8
1
(.0205)
0.50 BSC
(NOTE 4)
(.034)
0.52
REF
0.86
REF
0.127 ± 0.076
(.005 ± .003)
0.38 ± 0.10
MSOP (MS8) 0204
(DD8) DFN 1203
11
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