ISL33001IUZ-T Intersil, ISL33001IUZ-T Datasheet - Page 2
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ISL33001IUZ-T
Manufacturer Part Number
ISL33001IUZ-T
Description
IC BUS BUFF HOTSWAP 2WR 8MSOP
Manufacturer
Intersil
Type
I²C-Bus and SMBus Switchr
Datasheet
1.ISL33001IUZ.pdf
(19 pages)
Specifications of ISL33001IUZ-T
Applications
General Purpose, Buffer/Bus Extender
Internal Switch(s)
Yes
Voltage - Supply
2.3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
For Use With
ISL33001MSOPEVAL1Z - EVAL BOARD ISL33001 8MSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ISL33001IUZ-T
Manufacturer:
Intersil
Quantity:
6 000
Ordering Information
NOTES:
Pin Configurations
ISL33001IRTZ
ISL33001IRT2Z
ISL33001IBZ
ISL33001IUZ
ISL33002IRTZ
ISL33002IRT2Z
ISL33002IUZ
ISL33003IRTZ
ISL33003IRT2Z
ISL33003IUZ
ISL33001MSOPEVAL1Z
ISL33002MSOPEVAL1Z
ISL33003MSOPEVAL1Z
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
2. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
3. For Moisture Sensitivity Level (MSL), please see device information page for
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
information on MSL please see techbrief TB363.
PART NUMBER
(Notes 1, 2, 3)
SCL_OUT
SCL_IN
GND 4
EN
1
2
3
(8 LD TDFN)
ISL33001
TOP VIEW
3001
01R2
33001 IBZ
33001
3002
02R2
33002
3003
03R2
33003
ISL33001 Evaluation Board
ISL33002 Evaluation Board
ISL33003 Evaluation Board
PAD
2
MARKING
PART
ISL33001, ISL33002, ISL33003
8
7
6
5
SDA_OUT
V
SDA_IN
READY
CC1
TEMP. RANGE
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
(°C)
SCL_OUT
SCL_IN
8 Ld TDFN (0.5mm Pitch)
8 Ld SOIC
8 Ld MSOP
8 Ld TDFN (0.5mm Pitch)
8 Ld MSOP
8 Ld TDFN (0.5mm Pitch)
8 Ld MSOP
8 Ld TDFN (0.65mm Pitch)
8 Ld TDFN (0.65mm Pitch)
8 Ld TDFN (0.65mm Pitch)
GND
EN
ISL33001, ISL33002,
1
2
3
4
PACKAGE
(Pb-free)
(8 LD SOIC, MSOP)
ISL33001
TOP VIEW
ISL33003. For more
L8.3x3A
L8.3x3H
M8.15
M8.118
L8.3x3A
L8.3x3H
M8.118
L8.3x3A
L8.3x3H
M8.118
8
7
6
5
September 30, 2010
V
SDA_OUT
SDA_IN
READY
CC1
DWG. #
PKG.
FN7560.2