MXHV9910BTR IXYS, MXHV9910BTR Datasheet - Page 187
![no-image](/images/manufacturer_photos/0/3/352/ixys_sml.jpg)
MXHV9910BTR
Manufacturer Part Number
MXHV9910BTR
Description
IC LED DRIVER HIGH BRIGHT 8-SOIC
Manufacturer
IXYS
Type
HBLED Driverr
Specifications of MXHV9910BTR
Topology
AC DC Offline Switcher, PWM, Step-Down (Buck)
Number Of Outputs
1
Internal Driver
No
Type - Primary
Backlight
Type - Secondary
High Brightness LED (HBLED), RGB
Frequency
64kHz
Voltage - Supply
8 V ~ 450 V
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Operating Temperature
-40°C ~ 85°C
Internal Switch(s)
No
Efficiency
90%
Operating Supply Voltage
7.2 V to 8.4 V
Maximum Power Dissipation
2.5 W
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Output
-
Current - Output / Channel
-
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Power Semiconductor Chips
IXYS offers a wide range of dice for a multitude of applications.
IGBT Chips
G series, Low V
G series, High Speed type
S series, Low V
S series, High Speed type
MOSFET Chips
HiPerFET™ Power MOSFET
Standard Power MOSFET
Fast Recovery Diodes, Rectifier Diodes and Thyristor Chips in Planar Design
Bipolar Chips
Ultrafast FRED Chips
Low Leakage ultrafast FRED Chips
Fast Recovery Diode Chips
Rectifier Diodes
Phase Control Thyristors
Schottky Diodes
GaAs Diodes
Silicon Chip Resistors
Sonic Fast Recovery Diode Chips
CE(sat)
CE(sat)
type
type
The most important features of planar technology are:
- no PN junction termination in the underside or to the edges; thus non-critical
- fabricated using isolation diffusion with guard rings, channel stoppers and
- important electrical parameters 100% tested on the chips
- thyristor chips with center or corner gate construction
- chips with solderable or bondable metallization
- new standard 125 mm (5 inch) diameter wafers
IXYS can ship chips as follows:
Chips in wafer form, unsawed, electrically tested, rejects are inked
Chips in sawed wafer on foil, electrically tested, rejects are inked
Chips in tray (Waffle Pack), electrically tested
handling and simplified mounting
thick glass passivation to assure high electrical reliability and stability
1200 - 1600 V
1200 - 1800 V
300 - 1200 V
300 - 1200 V
600 - 1200 V
600 - 1400 V
600 - 1800 V
200 - 1200 V
200 - 1200 V
800 - 2200 V
70 - 1200 V
55 - 1100 V
V
1 - 10 W
8 - 180 V
RRM
V
V
CES
DSS
/ V
DRM
Contact Factory
0.005 - 4.5 W
0.013 - 4.5 W
I
F(AV)M
10 - 100 A
15 - 143 A
15 - 400 A
19 - 250 A
10 - 200 A
15 - 90 A
10 - 60 A
20 - 45 A
20 - 40 A
8 - 162 A
17 - 48 A
R
DS(on)
I
/ I
C
T(AV)M
150 - 250 ns
1.6 - 3.5 V
2.5 - 4.0 V
2.5 - 3.5 V
2.7 - 4.0 V
35 - 50 ns
35 - 40 ns
V
CE(sat)
tbd
t
t
-
-
-
-
-
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rr
165
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