MXHV9910BTR IXYS, MXHV9910BTR Datasheet - Page 187

• Manufacturer Part Number: MXHV9910BTR
• Description: IC LED DRIVER HIGH BRIGHT 8-SOIC
• Manufacturer: IXYS
• Type: HBLED Driverr

Specifications of MXHV9910BTR

• Topology: AC DC Offline Switcher, PWM, Step-Down (Buck)
• Number Of Outputs: 1
• Internal Driver: No
• Type - Primary: Backlight
• Type - Secondary: High Brightness LED (HBLED), RGB
• Frequency: 64kHz
• Voltage - Supply: 8 V ~ 450 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Operating Temperature: -40°C ~ 85°C
• Internal Switch(s): No
• Efficiency: 90%
• Operating Supply Voltage: 7.2 V to 8.4 V
• Maximum Power Dissipation: 2.5 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Current - Output / Channel: -

Power Semiconductor Chips
IXYS offers a wide range of dice for a multitude of applications.
IGBT Chips
G series, Low V
G series, High Speed type
S series, Low V
S series, High Speed type
MOSFET Chips
HiPerFET™ Power MOSFET
Standard Power MOSFET
Fast Recovery Diodes, Rectifier Diodes and Thyristor Chips in Planar Design
Bipolar Chips
Ultrafast FRED Chips
Low Leakage ultrafast FRED Chips
Fast Recovery Diode Chips
Rectifier Diodes
Phase Control Thyristors
Schottky Diodes
GaAs Diodes
Silicon Chip Resistors
Sonic Fast Recovery Diode Chips
CE(sat)
CE(sat)
type
type
The most important features of planar technology are:
- no PN junction termination in the underside or to the edges; thus non-critical
- fabricated using isolation diffusion with guard rings, channel stoppers and
- important electrical parameters 100% tested on the chips
- thyristor chips with center or corner gate construction
- chips with solderable or bondable metallization
- new standard 125 mm (5 inch) diameter wafers
IXYS can ship chips as follows:
Chips in wafer form, unsawed, electrically tested, rejects are inked
Chips in sawed wafer on foil, electrically tested, rejects are inked
Chips in tray (Waffle Pack), electrically tested
handling and simplified mounting
thick glass passivation to assure high electrical reliability and stability
1200 - 1600 V
1200 - 1800 V
300 - 1200 V
300 - 1200 V
600 - 1200 V
600 - 1400 V
600 - 1800 V
200 - 1200 V
200 - 1200 V
800 - 2200 V
70 - 1200 V
55 - 1100 V
V
1 - 10 W
8 - 180 V
RRM
V
V
CES
DSS
/ V
DRM
Contact Factory
0.005 - 4.5 W
0.013 - 4.5 W
I
F(AV)M
10 - 100 A
15 - 143 A
15 - 400 A
19 - 250 A
10 - 200 A
15 - 90 A
10 - 60 A
20 - 45 A
20 - 40 A
8 - 162 A
17 - 48 A
R
DS(on)
I
/ I
C
T(AV)M
150 - 250 ns
1.6 - 3.5 V
2.5 - 4.0 V
2.5 - 3.5 V
2.7 - 4.0 V
35 - 50 ns
35 - 40 ns
V
CE(sat)
tbd
t
t
-
-
-
-
-
rr
rr
165