MXHV9910BTR IXYS, MXHV9910BTR Datasheet - Page 190

• Manufacturer Part Number: MXHV9910BTR
• Description: IC LED DRIVER HIGH BRIGHT 8-SOIC
• Manufacturer: IXYS
• Type: HBLED Driverr

Specifications of MXHV9910BTR

• Topology: AC DC Offline Switcher, PWM, Step-Down (Buck)
• Number Of Outputs: 1
• Internal Driver: No
• Type - Primary: Backlight
• Type - Secondary: High Brightness LED (HBLED), RGB
• Frequency: 64kHz
• Voltage - Supply: 8 V ~ 450 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Operating Temperature: -40°C ~ 85°C
• Internal Switch(s): No
• Efficiency: 90%
• Operating Supply Voltage: 7.2 V to 8.4 V
• Maximum Power Dissipation: 2.5 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Current - Output / Channel: -

Direct Copper Bonded Ceramic Substrates
DCB Ceramic Substrates (Al
IXYS manufactures Direct Copper Bonded substrates on aluminum oxide (Al
substrates form the basis for new product ideas and electronic developments with a high degree of integration.
Standard bonded DCB panel dimensions are:
DCB parts are available as: • bonded plate
ALN - DCB on request
*
168
Unclad aluminum oxide ceramic
Conduction layers - both sides
DCB ceramic substrate
Al
dimensions
usable area
thickness
arc through voltage
thermal conductivity
copper thickness
conductor width
conductor spacing
spacing conductor/edge of ceramic
surface finishes available
peel-off resistance (DIN 532282)
application temperature range
resistant to hydrogen
thermal expansion coefficient
dimensions according
to customer specific drawing
= (for 0.25 mm thk.)
2
O
3
content
2
O
• bonded and patterned plate
• prelasered, unbroken plate
• individuale substrates
3
or AlN)
Patterned DCB substrates can be manufactured to customers‘ drawings.
DCB ceramic substrates fulfill several functions:
- carriers for the semiconductor chips and connection clips
- circuits similar to that on a PC board
- electrical isolator for separating the „current paths“ from the „heat paths“
- transfer medium for the heat dissipation from the active parts into the heat sink.
max. up to
typical
max.
min.
min.
min.
min.
128 x 210, 138 x 190.5, 115 x 165*
130 x 180, 130 x 200, 107 x 156*
bare copper; nickel plated;
0.3 (< 0.3 on request)
1.00, 0.63, 0.38, 0.25
nickel + gold plated
2
O
3
) or aluminum nitride (AlN) base. DCB ceramic
0.35 + / - 0.2
0.3 + / - 0.2
0.4 + / - 0.2
-55...+850
7.4 x 10-6
> 96
> 24
400
10
9
W/m · K
N/mm
mm
mm
mm
mm
mm
mm
mm
K-1
kV
°C
°C
%