HIP2100IB Intersil, HIP2100IB Datasheet - Page 11
![IC DRIVER HALF-BRIDGE 8-SOIC](/photos/7/40/74062/hip2100ib_sml.jpg)
HIP2100IB
Manufacturer Part Number
HIP2100IB
Description
IC DRIVER HALF-BRIDGE 8-SOIC
Manufacturer
Intersil
Datasheet
1.HIP2100IBZT.pdf
(12 pages)
Specifications of HIP2100IB
Configuration
Half Bridge
Input Type
PWM
Delay Time
20ns
Current - Peak
2A
Number Of Configurations
1
Number Of Outputs
2
High Side Voltage - Max (bootstrap)
114V
Voltage - Supply
9 V ~ 14 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Device Type
Half Bridge
Module Configuration
Half Bridge
Driver Case Style
SOIC
No. Of Pins
8
Operating Temperature Range
-40°C To +85°C
High Side Mosfet Drive Type
Bootstrapped
Rise Time
10ns
Rohs Compliant
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HIP2100IB
Manufacturer:
INTERSIL
Quantity:
2 385
Part Number:
HIP2100IB
Manufacturer:
INTERSIL
Quantity:
20 000
Part Number:
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Manufacturer:
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Quantity:
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Company:
Part Number:
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Manufacturer:
Intersil
Quantity:
7 627
Company:
Part Number:
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Manufacturer:
Intersil
Quantity:
500
Part Number:
HIP2100IBZ
Manufacturer:
HARRIS
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Company:
Part Number:
HIP2100IBZT
Manufacturer:
Intersil
Quantity:
7 500
Company:
Part Number:
HIP2100IBZT
Manufacturer:
INTERSIL
Quantity:
2 630
Part Number:
HIP2100IBZT
Manufacturer:
INTERSIL
Quantity:
20 000
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
Small Outline Plastic Packages (SOIC)
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
A
H
A1
11
α
0.10(0.004)
0.25(0.010)
M
L
h x 45°
B
M
C
HIP2100
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-012-AA ISSUE C)
0.0532
0.0040
0.013
0.0075
0.1890
0.1497
0.2284
0.0099
0.016
MIN
0°
0.050 BSC
INCHES
8
MAX
0.0688
0.0098
0.020
0.0098
0.1968
0.1574
0.2440
0.0196
0.050
8°
1.35
0.10
0.33
0.19
4.80
3.80
5.80
0.25
0.40
MILLIMETERS
MIN
0°
1.27 BSC
8
MAX
1.75
0.25
0.51
0.25
5.00
4.00
6.20
0.50
1.27
8°
Rev. 1 6/05
NOTES
FN4022.14
9
3
4
5
6
7
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-
-
-
-
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