SI8235BB-C-IS Silicon Laboratories Inc, SI8235BB-C-IS Datasheet - Page 3
![IC DUAL LOW SIDE DRIVER 16SOIC](/photos/7/41/74106/16-soic__7_5mmwidth__sml.jpg)
SI8235BB-C-IS
Manufacturer Part Number
SI8235BB-C-IS
Description
IC DUAL LOW SIDE DRIVER 16SOIC
Manufacturer
Silicon Laboratories Inc
Datasheet
1.SI8234BB-C-IS1.pdf
(52 pages)
Specifications of SI8235BB-C-IS
Package / Case
16-SOIC (0.300", 7.5mm Width)
Configuration
Low-Side
Input Type
Non-Inverting
Delay Time
60ns
Current - Peak
4A
Number Of Configurations
2
Number Of Outputs
2
Voltage - Supply
6.5 V ~ 24 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Mounting Style
SMD/SMT
Number Of Channels
2
Propagation Delay Time
30 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Supply Current
2 mA
Power Dissipation
1.2 W
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1899-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI8235BB-C-IS
Manufacturer:
Silicon Labs
Quantity:
135
Part Number:
SI8235BB-C-IS
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
T
Section
1. Top-Level Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4. Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7. Package Outline: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
9. Package Outline: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
10. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
11. Package Outline: 14 LD LGA (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
12. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
13. Package Outline: 14 LD LGA with Thermal Pad (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . .45
14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
15. Top Marking: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
16. Top Marking: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
17. Top Marking: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
ABLE O F
2.1. Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3.1. Typical Operating Characteristics (0.5 Amp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2. Typical Operating Characteristics (4.0 Amp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3. Family Overview and Logic Operation During Startup . . . . . . . . . . . . . . . . . . . . . . . 20
3.4. Power Supply Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.5. Power Dissipation Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
3.6. Layout Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.7. Undervoltage Lockout Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.8. Programmable Dead Time and Overlap Protection . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.1. High-Side/Low-Side Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.2. Dual Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.3. Dual Driver with Thermally Enhanced Package (Si8236) . . . . . . . . . . . . . . . . . . . . .29
C
ONTENTS
Rev. 1.1
Si823x
Page
3