FAN3268TMX Fairchild Semiconductor, FAN3268TMX Datasheet - Page 15
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FAN3268TMX
Manufacturer Part Number
FAN3268TMX
Description
IC BRIDGE DVR P/N-CH 2A 8SOIC
Manufacturer
Fairchild Semiconductor
Specifications of FAN3268TMX
Configuration
Half Bridge
Input Type
Inverting and Non-Inverting
Delay Time
14ns
Current - Peak
3A
Number Of Configurations
1
Number Of Outputs
2
Voltage - Supply
4.5 V ~ 18 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Operating Temperature (max)
125C
Operating Temperature (min)
-40C
Pin Count
8
Mounting
Surface Mount
Package Type
SOIC N
Case Length
5(Max)mm
Case Height
1.5(Max)mm
Screening Level
Automotive
Product
Half-Bridge Drivers
Rise Time
22 ns
Fall Time
17 ns
Propagation Delay Time
25 ns
Supply Voltage (max)
18 V
Supply Voltage (min)
4.5 V
Supply Current
1.2 mA
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Bridge Type
Half Bridge
Minimum Operating Temperature
- 40 C
Output Current
2.4 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
Compliant
Other names
FAN3268TMXTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FAN3268TMX
Manufacturer:
FSC
Quantity:
1 000
© 2009 Fairchild Semiconductor Corporation
FAN3268 • Rev. 1.0.0
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
1.75 MAX
R0.10
0.406
8°
0°
0.90
INDICATOR
PIN ONE
R0.10
(0.33)
6.20
5.80
0.25
0.10
1
8
DETAIL A
Figure 30. 8-Lead Small Outline Integrated Circuit (SOIC)
SCALE: 2:1
5.00
4.80
3.81
(1.04)
0.51
0.33
1.27
0.50
0.25
SEATING PLANE
4
5
0.25
x 45°
3.80
4.00
C
GAGE PLANE
A
0.36
M
B
C
0.10 C
B A
15
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.
E) DRAWING FILENAME: M08AREV13
MS-012, VARIATION AA, ISSUE C,
FLASH OR BURRS.
1.75
OPTION B - NO BEVEL EDGE
OPTION A - BEVEL EDGE
LAND PATTERN RECOMMENDATION
SEE DETAIL A
1.27
0.65
0.25
0.19
5.60
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