FAN3268TMX Fairchild Semiconductor, FAN3268TMX Datasheet - Page 15

• Manufacturer Part Number: FAN3268TMX
• Description: IC BRIDGE DVR P/N-CH 2A 8SOIC
• Manufacturer: Fairchild Semiconductor

Specifications of FAN3268TMX

• Configuration: Half Bridge
• Input Type: Inverting and Non-Inverting
• Delay Time: 14ns
• Current - Peak: 3A
• Number Of Configurations: 1
• Number Of Outputs: 2
• Voltage - Supply: 4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Operating Temperature (max): 125C
• Operating Temperature (min): -40C
• Pin Count: 8
• Mounting: Surface Mount
• Package Type: SOIC N
• Case Length: 5(Max)mm
• Case Height: 1.5(Max)mm
• Screening Level: Automotive
• Product: Half-Bridge Drivers
• Rise Time: 22 ns
• Fall Time: 17 ns
• Propagation Delay Time: 25 ns
• Supply Voltage (max): 18 V
• Supply Voltage (min): 4.5 V
• Supply Current: 1.2 mA
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Bridge Type: Half Bridge
• Minimum Operating Temperature: - 40 C
• Output Current: 2.4 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Compliant
• Other names: FAN3268TMXTR

© 2009 Fairchild Semiconductor Corporation
FAN3268 • Rev. 1.0.1
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
1.75 MAX
R0.10
0.406
8°
0°
0.90
INDICATOR
PIN ONE
R0.10
(0.33)
6.20
5.80
0.25
0.10
1
8
DETAIL A
Figure 30. 8-Lead Small Outline Integrated Circuit (SOIC)
SCALE: 2:1
5.00
4.80
3.81
(1.04)
0.51
0.33
1.27
0.50
0.25
SEATING PLANE
4
5
0.25
x 45°
3.80
4.00
C
GAGE PLANE
A
0.36
M
B
0.10 C
C
B A
15
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.
E) DRAWING FILENAME: M08AREV13
MS-012, VARIATION AA, ISSUE C,
FLASH OR BURRS.
1.75
OPTION B - NO BEVEL EDGE
OPTION A - BEVEL EDGE
LAND PATTERN RECOMMENDATION
SEE DETAIL A
1.27
0.65
0.25
0.19
5.60
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