MC33395TDWB Freescale Semiconductor, MC33395TDWB Datasheet - Page 14

• Manufacturer Part Number: MC33395TDWB
• Description: IC MOSFET PRE-DRVR 3PHASE 32SOIC
• Manufacturer: Freescale Semiconductor
• Type: 3 Phase Brushless DC Motor Controllerr

Specifications of MC33395TDWB

• Configuration: 3 Phase Bridge
• Input Type: Non-Inverting
• Delay Time: 650ns
• Number Of Configurations: 1
• Number Of Outputs: 3
• Voltage - Supply: 5.5 V ~ 24 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-SOIC (7.5mm Width)
• Operating Supply Voltage: - 0.3 V to + 7 V
• Supply Current: 1.8 mA
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Peak: -
• High Side Voltage - Max (bootstrap): -

14
33395
PACKAGING
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the 98ARH99137A listed below.
16
1
2X 16 TIPS
5.15
0.3 A
PIN 1 ID
B
10.3
7.6
7.4
B C
A
A
32
17
5
C
4
9
9
0.25
0.19
11.1
10.9
ROTATED 90 CLOCKWISE
0.13
B
6
SECTION A-A
PACKAGE DIMENSIONS
M
(0.29)
0.38
0.22
EW SUFFIX (PB-FREE)
C A
°
PACKAGING
PLASTIC PACKAGE
98ARH99137A
DWB SUFFIX
M
ISSUE A
(0.203)
2.65
2.35
32-PIN
BASE METAL
B
PLATING
8
C L
32X
A
30X
0.65
0.10
SEATING
PLANE
R0.08 MIN
GAUGE PLANE
0.25
A
8 °
0 °
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DATUMS B AND C TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSION OR GATE BURRS SHALL
NOT EXCEED 0.15 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH AND PROTRUSIONS SHALL
NOT EXCEED 0.25 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED 0.4 MM PER SIDE. DAMBAR
CANNOT BE LOCATED ON THE LOWER RADIUS
OR THE FOOT. MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD SHALL NOT
LESS THAN 0.07 MM.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
THESE DIMENSIONS APPLY TO THE FLAT
SECTION OF THE LEAD BETWEEN 0.10 MM AND
0.3 MM FROM THE LEAD TIP.
THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES
OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTER-LEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF
THE PLASTIC BODY.
Analog Integrated Circuit Device Data
0.9
0.5
SECTION B-B
0 °
MIN
Freescale Semiconductor
0.29
0.13