BUK215-50Y,118 NXP Semiconductors, BUK215-50Y,118 Datasheet - Page 12

• Manufacturer Part Number: BUK215-50Y,118
• Description: MOSFET N-CH 50V 9A SOT426
• Manufacturer: NXP Semiconductors
• Series: TOPFET™r
• Type: High Sider

Specifications of BUK215-50Y,118

• Package / Case: D²Pak, TO-263 (4 leads + tab)
• Input Type: Non-Inverting
• Number Of Outputs: 1
• On-state Resistance: 28 mOhm
• Current - Output / Channel: 9A
• Current - Peak Output: 45A
• Voltage - Supply: 5.5 V ~ 35 V
• Mounting Type: Surface Mount
• On Resistance (max): 0.038 Ohms
• Maximum Power Dissipation: 67000 mW
• Mounting Style: SMD/SMT
• Supply Current: 2 mA
• Switch Type: High Side
• Power Switch Family: BUK215-50YT
• Power Switch On Resistance: 48mOhm
• Output Current: 9A
• Mounting: Surface Mount
• Package Type: D2PAK
• Pin Count: 4 +Tab
• Power Dissipation: 67W
• Operating Temperature: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 934055401118; BUK215-50Y /T3; BUK215-50Y /T3

Philips Semiconductors
MECHANICAL DATA
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
May 2001
TOPFET high side switch
SMD version of BUK210-50Y
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
Plastic single-ended surface mounted package (Philips version of D
(one lead cropped)
DIMENSIONS (mm are the original dimensions)
UNIT
mm
Fig.34. SOT426 surface mounting package
OUTLINE
VERSION
SOT426
4.50
4.10
A
H D
1.40
1.27
A 1
D
D 1
0.85
0.60
b
IEC
1
0.64
0.46
c
e
max.
11
D
2
e
E
JEDEC
1.60
1.20
3
D 1
4
e
REFERENCES
10.30
e
9.70
E
0
5
1.70
b
e
scale
EIAJ
12
2.5
1
2.90
2.10
L p
, centre pin connected to mounting base.
5 mm
15.80
14.80
H D
2.60
2.20
mounting
2
Q
-PAK); 5 leads
base
L p
A 1
Q
PROJECTION
c
EUROPEAN
A
ISSUE DATE
98-12-14
99-06-25
Product specification
BUK215-50Y
SOT426
Rev 1.010