VND1NV0413TR STMicroelectronics, VND1NV0413TR Datasheet - Page 19

• Manufacturer Part Number: VND1NV0413TR
• Description: MOSFET POWER OMNIFET II DPAK
• Manufacturer: STMicroelectronics
• Series: OMNIFET II™r
• Type: Low Sider

Specifications of VND1NV0413TR

• Input Type: Non-Inverting
• Number Of Outputs: 1
• On-state Resistance: 250 mOhm
• Current - Peak Output: 1.7A
• Mounting Type: Surface Mount
• Package / Case: DPak, TO-252 (2 leads+tab), SC-63
• Switch Type: Low Side
• Power Switch Family: VND1NV04
• Power Switch On Resistance: 250mOhm
• Output Current: 1.7A
• Mounting: Surface Mount
• Supply Current: 100uA
• Package Type: TO-252
• Pin Count: 2 +Tab
• Power Dissipation: 35W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Current - Output / Channel: -
• Lead Free Status / Rohs Status: Not Compliant

VND1NV04 - VNN1NV04 - VNS1NV04
4.2
Table 5.
SOT-223 thermal data
Figure 34. SOT-223 PC board
1. Layout condition of R
Cu thickness=35 µm , Copper areas: from minimum pad layout to 0.8 cm
Area/island (cm
DPAK thermal parameter
C1 (W·s/°C)
C2 (W·s/°C)
C3 (W·s/°C)
C4 (W·s/°C)
C5 (W·s/°C)
C6 (W·s/°C)
R1 (°C/W)
R2 (°C/W)
R3 (°C/W)
R4 (°C/W)
R5 (°C/W)
R6 (°C/W)
th
and Z
th
2
)
measurements (PCB FR4 area = 58 mm x 58 mm,PCB thickness = 2 mm,
Doc ID 7381 Rev 2
.
0.00006
0.0005
0.01
0.45
0.25
0.8
1.6
0.8
0.3
0.8
15
61
2
Package and PCB thermal data
2
).
24
6
5
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